Interfacial bonding mechanism using silver metallo-organic nanoparticles to bulk metals and observation of sintering behavior
Interfacial bonding mechanism using silver metallo-organic nanoparticles to bulk metals and observation of sintering behavior
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DOI：
10.2320/matertrans.mf200805
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发表时间：
2008-07-01
影响因子：
1.2
通讯作者：
Ide, Eiichi
中科院分区：
文献类型：
--
作者：
Akada, Yusuke;Tatsumi, Hiroaki;Ide, Eiichi
我们提出了一种新的键合工艺，使用银纳米粒子。其可以替代富铅的高熔点焊料。利用透射电子显微镜（TEM）观察了银金属有机纳米粒子与块体材料（金、铜）的键合界面，探讨了键合机理。在烧结银和大块金的界面处。银的晶体取向对应于金的晶体取向。据认为，通过银纳米颗粒在金晶体的方向上取向而形成的银外延层。在烧结态银与块体铜的界面处，没有在铜晶体上形成银的外延层。虽然银/铜界面的晶体结构形貌与银/金界面的晶体结构形貌不同。铜和金都与银结合。并已成功地结合使用的银纳米粒子。
We have proposed a novel bonding process using silver nanoparticles. which can be alternative to lead-rich high melting point solders. The bonding mechanism of silver metallo-organic nanoparticles to bulk materials (gold and copper) is discussed based on the observations of the bonded interface using Transmission Electron Microscope (TEM). At the interface of sintered silver and bulk gold. the crystal orientation of silver corresponded to that of gold. It is thought that the epitaxial layer of silver formed through silver nanoparticles being oriented in the direction of the gold crystal. At the interface of sintered silver and bulk copper, no epitaxial layer of silver on the copper crystal formed. Though the appearance of the crystal structure of silver/copper interface is different from that of the silver/gold interface. copper as well as gold are coherent with silver. and have been Successfully bonded using the silver nanoparticles.