Fabrication of Ultra-Low Resonance Frequency Inertial MEMS using Through-Silicon Deep-RIE Applied to Silicon-on-Glass
Fabrication of Ultra-Low Resonance Frequency Inertial MEMS using Through-Silicon Deep-RIE Applied to Silicon-on-Glass
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发表时间：
2023-06
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通讯作者：
Junhui Wu;Hui Zhang;Tamio Ikehashi
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作者：
Junhui Wu;Hui Zhang;Tamio Ikehashi
本文报道了一种适用于低谐振频率惯性MEMS传感器的制造工艺。低谐振频率是通过电可调弹簧和通过硅深- rie （TSD）形成的大质量应用于硅-玻璃（SOG）。为了解决低谐振频率结构引起的TSD热问题，通过引入TSD步骤之间的冷却时间和采用Al硬掩膜来增强散热。提出了一种防止MEMS损伤的刀片切割方法。设备的运行是通过测量来确认的。
This paper reports on a fabrication process suitable for low-resonance-frequency inertial MEMS sensors. The low resonance frequency is attained by electrically tunable springs and a large mass formed by a through-silicon Deep-RIE (TSD) applied to a Silicon-on-Glass (SOG). To solve a thermal issue of TSD originating from the low-resonance-frequency structure, the heat dissipation is enhanced by introducing cooling time between the TSD steps and by adopting an Al hard mask. A blade dicing method that prevents MEMS damage is also presented. The device operation is confirmed by measurements.