Effect of adherend temperature on bond strengths of resin bonding systems to denture base resin and a semi-precious alloy.
Effect of adherend temperature on bond strengths of resin bonding systems to denture base resin and a semi-precious alloy.
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粘合体温度对树脂粘合系统与义齿基托树脂和半贵合金粘合强度的影响。
DOI：
10.4012/dmj.2012-189
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发表时间：
2013
影响因子：
2.5
通讯作者：
Takuo Tanaka
中科院分区：
文献类型：
--
作者：
Sadaaki Murahara;H. Minami;Shiro Suzuki;Kenji Sakoguchi;Daisaku Shiomuki;Y. Minesaki;Takuo Tanaka
研究了粘接温度对自聚树脂与义齿基托树脂及4-Meta/MMA-TBBO树脂与银钯铜金合金剪切粘接强度的影响。当粘合体温度为10 ° C、23 ° C、37 ° C或55°C时进行粘结程序，并且在热循环之前和之后测量剪切粘结强度（SBS）。在热循环前，每种粘合剂树脂的四种被粘体温度之间的粘合强度没有显著差异：自聚合树脂为31.59±6.11-32.89±2.12 MPa; 4-Meta/MMA-TBBO树脂为35.43±2.2-38.38±0.61 MPa。热循环后，自聚合树脂与义齿基托树脂（30.02±2.29 MPa）的最佳粘合体温度为37 ℃，4-Meta/MMA-TBBO树脂与Ag-Pd-Cu-Au合金（37.14±2.17 MPa）的最佳粘合体温度为10 ℃。
This study investigated the effect of adherend temperature on shear bond strengths of auto-polymerizing resin to denture base resin and 4-META/MMA-TBBO resin to silver-palladium-copper-gold (Ag-Pd-Cu-Au) alloy. Bonding procedure was carried out when adherend temperature was 10, 23, 37, or 55°C, and shear bond strengths (SBSs) were measured before and after thermocycling. Before thermocycling, there were no significant differences in bond strength among the four adherend temperatures for each adhesive resin: 31.59±6.11-32.89±2.12 MPa for auto-polymerizing resin; 35.43±2.2-38.38±0.61 MPa for 4-META/MMA-TBBO resin. After thermocycling, optimal adherend temperature to achieve the highest bond strength was 37°C for auto-polymerizing resin to denture base resin (30.02±2.29 MPa) and 10ºC for 4-META/MMA-TBBO resin to Ag-Pd-Cu-Au alloy (37.14±2.17 MPa).