Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders
Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders
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DOI：
10.1557/jmr.2002.0036
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发表时间：
2002-02-01
影响因子：
2.7
通讯作者：
Kao, CR
中科院分区：
文献类型：
--
作者：
Chen, WT;Ho, CE;Kao, CR
99.3Sn-0.7Cu共晶钎料（wt%，Sn-0.7Cu）是波峰焊应用中最有前途的Sn-Pb共晶钎料无铅替代品。在这项研究中，在Sn-0.7Cu焊料和Ni之间的反应的Cu浓度的小扰动的效果进行了研究。具体来说，四种Sn-xCu焊料（x = 0.2、0.4、0.7和1）在250摄氏度下与Ni反应。Cu浓度的轻微变化产生完全不同的反应产物。当Cu浓度较低（x = 0.2）时，反应产物为（Ni 1-xCux）（3）Sn-4。在高Cu浓度（x = 0.7和1）下，反应产物为（Cu 1-yNiy）（6）Sn-5。当Cu浓度介于两者之间（x = 0.4）时，形成（Nil-xCux）（3）Sn-4和（Cu 1-yNiy）（6）Sn-5。上述发现是合理的使用Cu-Ni-Sn等温线。该研究的结果意味着在工业生产中必须严格控制Cu浓度以在界面处产生所需的金属间化合物。
The eutectic 99.3Sn-0.7Cu solder (wt%, Sn-0.7Cu) is the most promising lead-free replacement for the eutectic Sn-Pb solder in wave-soldering applications. In this study, the effect of a small perturbation in the Cu concentration on the reaction between the Sn-0.7Cu solder and Ni was investigated. Specifically, four Sn-xCu solders (x = 0.2, 0.4, 0.7, and 1) were reacted with Ni at 250 degreesC. A slight variation in Cu concentration produced completely different reaction products. When the Cu concentration was low (x = 0.2), the reaction product was (Ni1-xCux)(3)Sn-4. At high Cu concentrations (x = 0.7 and 1), the reaction product was (Cu1-yNiy)(6)Sn-5. When the Cu concentration was in-between (x = 0.4), both (Nil-xCux)(3)Sn-4 and (Cu1-yNiy)(6)Sn-5, formed. The above findings were rationalized using the Cu-Ni-Sn isotherm. the results of this study imply that the Cu concentration must be strictly controlled in industrial production to produce the desired intermetallic at the interface.