Mechanical properties and electrical conductivity of nano-La2O3 reinforced copper matrix composites fabricated by spark plasma sintering
Mechanical properties and electrical conductivity of nano-La2O3 reinforced copper matrix composites fabricated by spark plasma sintering
复制标题
放电等离子烧结纳米La2O3增强铜基复合材料的力学性能和电导率
DOI：
10.1088/2053-1591/ab36f7
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发表时间：
2019-08
影响因子：
2.3
通讯作者：
Li Nana
中科院分区：
文献类型：
--
作者：
Zheng Runguo;Li Nana
以铜镧合金粉末为原料，采用内氧化和放电等离子烧结相结合的方法制备了纳米La2O3增强铜基复合材料。研究了不同烧结温度下La_2O_3/Cu复合材料的显微组织、力学性能和电导率。结果表明，由于原位生成的La_2O_3颗粒主要分布在晶界上，有效地抑制了烧结过程中铜晶界的迁移，使La_2O_3/Cu复合材料的晶粒尺寸达到了微米级。在850℃下烧结的La_2O_3/Cu复合材料的极限抗拉强度、屈服强度和硬度分别是Cu-La合金的1.23倍、2.2倍和1.5倍。电导率高达92.79%IACS。但延伸率明显小于铜-镧合金。根据实验结果，对该材料的强化机理和导电机理进行了研究。
The nano-La2O3 reinforced copper matrix composites were fabricated by a combination method of internal oxidation and spark plasma sintering (SPS) using Cu-La alloy powders. The microstructure, mechanical properties and electrical conductivity of the La2O3/Cu composites were investigated at different sintering temperatures. The results show that the grain size of the La2O3/Cu composites is a few microns due to the in situ generated La2O3 particles, which are predominantly distributed on the grain boundaries and effectively suppress migration of Cu grain boundary during the sintering process. The ultimate tensile strength, yield strength and hardness of La2O3/Cu composite sintered at 850 °C are 1.23 times, 2.2 times and 1.5 times that of Cu-La alloy, respectively. And the electrical conductivity is as high as 92.79% IACS. However, the elongation is significantly smaller than that of Cu-La alloy. Moreover, the strengthening mechanism and conductive mechanism of the material were studied based on the experimental results.
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影响因子：
9.1
作者：
S. M. Uddin;T. Mahmud;Christoph Wolf;Carsten Glanz;I. Kolaric;Christoph Volkmer;H. Höller;Ulrich Wi
通讯作者：
S. M. Uddin;T. Mahmud;Christoph Wolf;Carsten Glanz;I. Kolaric;Christoph Volkmer;H. Höller;Ulrich Wi
影响因子：
3
作者：
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通讯作者：
D. W. Lee;B. K. Kim
DOI：
10.1016/j.jmrt.2016.01.003
发表时间：
2016-10-01
影响因子：
6.4
作者：
Dinaharan, Issac;Sathiskumar, Ramasamy;Murugan, Nadarajan
通讯作者：
Murugan, Nadarajan
DOI：
10.1016/j.msea.2008.10.038
发表时间：
2009-04
影响因子：
6.4
作者：
H. Zuhailawati;T. L. Yong
通讯作者：
H. Zuhailawati;T. L. Yong
DOI：
10.1016/j.msea.2005.11.030
发表时间：
2006-02-25
影响因子：
6.4
作者：
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通讯作者：
Cockeram, BV