Slice thickness measurements.
Slice thickness measurements.
复制标题
切片厚度测量。
DOI：
10.7863/jum.1988.7.9.487
复制
发表时间：
1988
影响因子：
2.3
通讯作者：
A. Goldstein
中科院分区：
文献类型：
--
作者：
A. Goldstein
讨论了一种新的切片厚度测试对象，并给出了使用6种不同商用扫描仪的13个换能器进行可行性测试的结果。面内波束宽度和切片厚度测量都可以很容易地进行和解释。对于适当的设备增益设置，切片厚度测量结果与测试对象中组织模拟（TM）填充的接收器增益无关。这可以通过一个简单的模型来解释，在这个模型中，测试对象的低振幅内部填充回波有效地充当了相对于薄片厚度剖面回波的不变测量参考电平。该模型还预测，在临床图像中，平面内横向分辨率（和切片厚度）将由邻近组织之间的局部图像对比度以及光束剖面决定。不同类型实时传感器的薄片厚度测量结果显示了其固有的薄片厚度焦点特性。
A new slice thickness test object is discussed, with results of feasibility tests using 13 transducers from six different commercial scanners presented. Both inplane beamwidth and slice thickness measurements could be easily performed and interpreted. For proper equipment gain settings the slice thickness measurement results were found to be independent of receiver gain with a tissue‐mimicking (TM) fill in the test object. This is explained by a simple model in which test object low‐amplitude internal fill echoes effectively act as an invariant measurement reference level with respect to the slice thickness profile echoes. This model also predicts that in clinical images the inplane lateral resolution (and slice thickness) will be governed by the local image contrast between adjacent tissues as well as the beam profile. Slice thickness measurement results from various types of real‐time transducers demonstrate their inherent slice thickness focal characteristics.