Toward Control of Microstructure in Microscale Additive Manufacturing of Copper Using Localized Electrodeposition
Toward Control of Microstructure in Microscale Additive Manufacturing of Copper Using Localized Electrodeposition
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DOI：
10.1002/adem.201800946
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发表时间：
2019-01-01
影响因子：
3.6
通讯作者：
Minary-Jolandan, Majid
中科院分区：
文献类型：
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作者：
Daryadel, Soheil;Behroozfar, Ali;Minary-Jolandan, Majid
金属的微尺度增材制造（mu-AM）的进展需要针对各种功能应用的微结构工程。特别是，在3D打印过程中实现对微观结构的原位控制对于消除对后处理和退火的需求至关重要。最近的报道已经证明了纳米孪晶金属的电化学μ-AM的可能性，其中已知孪晶边界（TB）的平行阵列的存在增强机械和电学性能。作者首次报告说，使用微尺度局部脉冲电沉积（L-PED）工艺打印的金属的微观结构可以在3D打印过程中原位控制。特别是，作者表明，通过电化学工艺参数的密度和定向的TB，以及晶粒尺寸可以控制。对直接3D打印的微柱进行的原位SEM微压缩实验的结果表明，这种对微观结构的控制与打印金属的机械性能直接相关。
The progress in microscale additive manufacturing (mu-AM) of metals requires engineering of the microstructure for various functional applications. In particular, achieving in situ control over the microstructure during 3D printing is critical to eliminate the need for post-processing and annealing. Recent reports have demonstrated the possibility of electrochemical mu-AM of nanotwinned metals, in which the presence of parallel arrays of twin boundaries (TBs) are known to enhance mechanical and electrical properties. For the first time, the authors report that the microstructure of metals printed using the microscale localized pulsed electrodeposition (L-PED) process can be controlled in situ during 3D-printing. In particular, the authors show that through electrochemical process parameters the density and the orientation of the TBs, as well as the grain size can be controlled. The results of the in situ SEM microcompression experiments on directly 3D-printed micro-pillars show that such control over microstructure directly correlates with the mechanical properties of the printed metal.