Investigating the effect of applied pressure on reactive multilayer foil joining
Investigating the effect of applied pressure on reactive multilayer foil joining
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DOI：
10.1016/j.actamat.2004.07.012
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发表时间：
2004-10-18
期刊：
影响因子：
9.4
通讯作者：
Weihs, TP
中科院分区：
文献类型：
--
作者：
Wang, J;Besnoin, E;Weihs, TP
本文描述了施加压力对使用纳米结构 Al/Ni 箔以及 AuSn 和 AgSn 焊料层反应连接不锈钢样品和铝合金样品的影响。对于给定的材料系统，施加更高的接合压力可以增强熔融焊料的流动，从而改善润湿和粘合。反应接头的剪切强度随着连接过程中施加的压力上升到临界值而增加。在较高的施加压力下，接头剪切强度保持相对恒定。临界施加的连接压力取决于箔厚度（或总反应热）以及焊料材料和元件的特性，这些特性决定焊料熔化的持续时间以及焊料/元件界面处的最高温度。较长的熔化时间和较高的界面温度可增强焊料的流动性，改善润湿条件并导致较低的临界施加压力。 (C) 2004 Acta Materialia Inc. 由 Elsevier Ltd 出版。保留所有权利。
This paper describes the effect of applied pressure on reactive joining of stainless steel specimens and Al alloy specimens using nanostructured Al/Ni foils and AuSn and AgSn solder layers. For a given material system, higher applied joining pressure enhances the flow of the molten solder and thus improves wetting and bonding. Shear strengths of the reactive joints are shown to increase as the pressure that is applied during joining rises to a critical value. At higher applied pressures joint shear strengths remain relatively constant. The critical applied joining pressure is shown to be dependent on the foil thickness (or total heat of reaction), and the properties of the solder material and components, which determine the duration of melting of the solder and the maximum temperature at the solder/component interface. Longer durations of melting and higher interface temperatures enhance the flow of solder, improve wetting conditions and result in lower critical applied pressures. (C) 2004 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.