Flexible photonics in low stiffness doped silica for use in fibre reinforced polymer composite materials
Flexible photonics in low stiffness doped silica for use in fibre reinforced polymer composite materials
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DOI：
10.1016/j.optmat.2022.113133
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发表时间：
2022-12
影响因子：
3.9
通讯作者：
C. Holmes;M. Godfrey;P. Mennea;S. Zahertar;J. Dulieu-Barton
中科院分区：
文献类型：
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作者：
C. Holmes;M. Godfrey;P. Mennea;S. Zahertar;J. Dulieu-Barton
描述了在掺杂二氧化硅中生产柔性光子器件，其杨氏模量显著小于传统二氧化硅玻璃的杨氏模量。这里，降低模量的目的是使平面传感器更适用于集成到纤维增强聚合物复合结构中。柔性平面衬底（58 μm厚）由三层掺杂二氧化硅层组成，采用牺牲硅晶片工艺制造。它表明，可以实现约40 GPa的杨氏模量相比，典型的二氧化硅玻璃的值高于70 GPa。描述了在柔性玻璃平台的中心芯层内直接UV写入的少模波导的光学响应。平台的机械刚度是使用纳米压痕测试确定的，并在机械测试中得到证实，这些测试清楚地证明了平台的柔性性质。为了评估集成到承受机械载荷的结构中的应用程序的可用性，研究了100万次弯曲循环的疲劳寿命。在执行的测试中未观察到光学响应退化。
The production of a flexible photonic device in doped silica with a Young's modulus that is significantly less than that of traditional silica glass is described. Here the purpose of reducing the modulus is to make planar sensors more applicable for integration into fibre reinforced polymer composite structures. The flexible planar substrate (58 μm thick) consists of three doped silica layers, fabricated using sacrificial silicon wafer processing. It is demonstrated that a Young's modulus of around 40 GPa can be achieved in comparison to a value above 70 GPa for typical silica glass. The optical response of a few mode waveguide that is direct UV written within the central core layer of the flexible glass platform is described. The mechanical stiffness of the platform is determined using nano-indentation tests and confirmed in mechanical tests that demonstrate clearly the flexible nature of the platform. To assess usability for applications integrated into structures undergoing mechanical loading the fatigue lifetime for one million bending cycles is investigated. No degradation to the optical response was observed under the performed testing.