Polymer mechanically interlocking structures as interconnects for microfluidic systems
Polymer mechanically interlocking structures as interconnects for microfluidic systems
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DOI：
10.1088/0960-1317/18/3/035043
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发表时间：
2008-03-01
影响因子：
2.3
通讯作者：
Gray, B. L.
中科院分区：
文献类型：
--
作者：
Jaffer, S.;Gray, B. L.
本文描述了由 SU-8 光聚合物、聚二甲基硅氧烷 (PDMS) 和硅制成的钉孔式机械互连件，用于连接不同材料的微流体组件以创建复杂的微型仪器。互连件组装成顺应的互锁圆柱体，当与小几微米到几十微米的孔组装时，圆柱体会变形，从而在基板之间提供机械连接以及流体互连。示例结构具有100-200μm的标称外半径、50-100μm的内半径以及200-400μm的长度。 ANSYS 机械仿真用于分析机械附件的最佳互连尺寸，并预测范围从 0 到 232 mN 的拆卸力。使用受控力线性致动器制造互连件并进行实验测试，以产生 20 至 130 mN 的拆卸力。加压测试表明，SU-8 互连件可将水压保持在 200 kPa 而不会泄漏，而 PDMS 互连件可将气压保持在 21 kPa，水压保持在大约 6.9 kPa。
This paper describes peg-in-hole type mechanical interconnects made of SU-8 photopolymer, polydimethylsiloxane ( PDMS) and silicon for joining microfluidic components of disparate materials to create complex microinstruments. Interconnects assemble as compliant interlocking cylinders that deform when assembled with holes that are smaller by several to several tens of microns, thus providing mechanical attachment as well as fluid interconnects between substrates. Example structures have nominal outer radii of 100-200 mu m, inner radii of 50-100 mu m and lengths of 200-400 mu m. ANSYS mechanical simulations are employed to analyze the optimal interconnect sizing for a mechanical attachment, as well as predict disassembly forces ranging from zero to 232 mN. The interconnects are fabricated and experimentally tested with a controlled-force linear actuator to yield disassembly forces ranging from 20 to 130 mN. Pressurization tests demonstrate that SU-8 interconnects hold water pressure to 200 kPa without leaking and PDMS interconnects hold air pressure to 21 kPa and water pressure to roughly 6.9 kPa.