Core-Shell Nanowire Based Electrical Surface Fastener Used for Room-Temperature Electronic Packaging Bonding
Core-Shell Nanowire Based Electrical Surface Fastener Used for Room-Temperature Electronic Packaging Bonding
复制标题
用于室温电子封装粘合的基于核壳纳米线的电气表面紧固件
DOI：
10.1007/s13391-014-8005-7
复制
发表时间：
2014
影响因子：
2.4
通讯作者：
A. Hosoi
中科院分区：
文献类型：
--
作者：
P. Wang;Y. Ju;A. Hosoi
随着电子封装的不断小型化，传统的焊料遭受严重的性能下降。此外，传统回流焊工艺所需的高温可能会损坏电子元件。因此，人们越来越迫切地需要一种新型的无毒焊料，能够在低温下提供良好的机械应力和电接触。提出了一种用于微电子封装键合的纳米线表面紧固件的室温制备方法。这种表面固定器由铜芯和聚苯乙烯壳的纳米线阵列组成。它的粘合强度为1.24 N/cm 2，电阻为1.41 × 10−2Ω·cm 2。这种纳米线表面紧固件可以实现涉及电子封装中的组件的组装的广泛应用的探索。
With the ongoing miniaturization in electronic packaging, the traditional solders suffer from severe performance degradation. In addition, the high temperature required in the traditional solder reflow process may damage electronic elements. Therefore, there is an increasing urgent need for a new kind of nontoxic solder that can afford good mechanical stress and electrical contact at low temperature. This paper presents a method of fabricating nanowire surface fastener for the application of microelectronic packaging bonding at room temperature. This surface fastener consists of copper core and polystyrene shell nanowire arrays. It showed an adhesive strength of ∼24 N/cm2and an electrical resistance of ∼0.41 × 10−2Ω·cm2. This kind of nanowire surface fastener may enable the exploration of wide range applications, involving assembly of components in the electronic packaging.