Adhesion studies of Cu‐Cr alloys on Al2O3
Adhesion studies of Cu‐Cr alloys on Al2O3
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Cu-Cr合金在Al2O3上的附着力研究
DOI：
10.1063/1.108888
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发表时间：
1993
期刊：
影响因子：
--
通讯作者：
A. Schrott
中科院分区：
文献类型：
--
作者：
C. Chan;Chin;C. Farrell;A. Schrott
研究了Cu - Cr合金与c轴蓝宝石晶圆的粘附性。当Cr含量超过15at时，剥离强度有较大的提高。%为沉积合金薄膜。由于Cr在亚稳合金结构中具有较高的自由能，从而使其偏析到蓝宝石-合金界面，从而获得了较高的剥离强度。热处理可大大提高低Cr （15at）合金的附着力。%) Cu - Cr合金到c轴蓝宝石。经过适当的热处理，发现铬在蓝宝石-合金界面上偏析或在Cu基体中以球形析出相分离。在低至200℃的退火温度下，蓝宝石与低铬合金界面的剥离强度有所提高。
Adhesion of Cu‐Cr alloys to c‐axis sapphire wafers has been studied. A large increase in peel strength was observed when the Cr content exceeded 15 at. % for the as‐deposited alloy films. The high measured peel strength can be attributed to Cr that segregates to the sapphire‐alloy interface due to its high free energy in the metastable alloy structure. Heat treatment was found to greatly enhance the adhesion of low Cr containing (15 at. %) Cu‐Cr alloys to c‐axis sapphire. Cr was found to segregate to the sapphire‐alloy interface or separate as spherical precipitates in the Cu matrix upon appropriate thermal treatment. Increase in peel strength between sapphire and the low Cr alloy interface was observed at annealing temperatures as low as 200 °C.