Highly Flexible and Self-Healable Thermal Interface Material Based on Boron Nitride Nanosheets and a Dual Cross-Linked Hydrogel
Highly Flexible and Self-Healable Thermal Interface Material Based on Boron Nitride Nanosheets and a Dual Cross-Linked Hydrogel
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DOI：
10.1021/acsami.6b16195
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发表时间：
2017-03-22
影响因子：
9.5
通讯作者：
Zhi, Chunyi
中科院分区：
文献类型：
--
作者：
Jiang, Hongbo;Wang, Zifeng;Zhi, Chunyi
柔性和可拉伸电子器件的蓬勃发展和不断增加的功率和多功能性要求新型高效的热界面材料（TIM）具有多功能性，如高变形性和自修复能力，而传统的金属基或油脂基材料很难提供。在此，我们报告了一种高度灵活的和自我愈合的双交联水凝胶基纳米复合材料填充六方氮化硼（h-BN）纳米片通过原位聚合的丙烯酸（AA）制造。复合材料的热导率可以通过调节BNNSs的分数和水含量来调节。虽然是固体，但开发的TIM的高度柔性特性使其能够完美地复制粗糙表面的纹理，这可以大大增强相邻表面之间的热传递。通过增加含水量来软化材料，它可以回收并重新用于各种粗糙表面。此外，得益于双交联结构，该复合材料能够恢复机械强度和热导率，即使从严重的结构故障，例如，三个连续的切割和愈合周期。该研究为制备多功能高柔性TIM奠定了基础，对散热材料的发展具有重要的推动作用。
The booming growth of flexible and stretchable electronic devices with increasing power and multifunctionalities calls for novel highly efficient thermal interface materials (TIMs) with versatile functions, such as high deformability and self-healing ability, whereas traditional metallic-based or grease-based ones could hardly provide. Herein, we report a highly flexible and self-healable dual-cross-linked hydrogel-based nanocomposite filled with hexagonal boron nitride (h-BN) nanosheets fabricated by in situ polymerization of acrylic acid (AA). The thermal conductivity of the composites can be tuned by adjusting both fraction of BNNSs and water content. Although a solid, the highly flexible characteristic of the developed TIMs enables a perfect ability to replicate the texture of a rough surface, which may greatly enhance thermal transfer between adjacent surfaces. By increasing the water content to soften the material, it can be recycled and reused for different kinds of rough surface. In addition, benefiting from the dual-cross-linked structure, the composites are capable of recovering both mechanical strength and thermal conductivity even from severe structural breakdowns, for example, three consecutive cutting and healing cycles. This study may pave the way to fabrication of multifunctional highly flexible TIMs, which may promote the development of heat dissipation materials.