A multimaterial 3D printing-assisted micropatterning for heat dissipation applications
A multimaterial 3D printing-assisted micropatterning for heat dissipation applications
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DOI：
10.1007/s42114-023-00672-x
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发表时间：
2023-05
影响因子：
20.1
通讯作者：
Sayli Jambhulkar;Dharneedar Ravichandran;Varunkumar Thippanna;Dhanush Patil;Kenan Song
中科院分区：
文献类型：
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作者：
Sayli Jambhulkar;Dharneedar Ravichandran;Varunkumar Thippanna;Dhanush Patil;Kenan Song
微图案化结构在微芯片、电路板设计、微流体、蒸发器/冷凝器盘管、微电子、超表面和其他功能装置中具有应用。传统的微制造技术包括光刻、气相沉积和激光写入。然而，这些方法具有缓慢的处理速率、复杂的要求或昂贵的程序。因此，以高生产率和高分辨率特征在大规模表面上制造微图案化结构是具有挑战性的。因此，这项研究的重点是一种非传统的无掩模微图案化技术，该技术结合了能够处理多种材料的自下而上的3D打印和用于选择性消除牺牲材料的自上而下的湿法蚀刻。独特的3D打印，多相直接墨水书写（MDIW），利用各种聚合物和纳米颗粒系统作为原料，用于沉积包含32-128个不同组成的子层的层状结构（即，可湿蚀刻的牺牲油墨和紫外线可固化的图案化油墨）。光敏油墨的快速相变（即，环氧树脂和氮化硼（BN））固化到固化特征中使得能够对牺牲油墨进行“微限制”（即，聚乙烯亚胺）。随后，湿法蚀刻可以通过在聚合物-溶剂界面处的溶剂扩散和聚合物溶解来局部地和选择性地溶解牺牲聚合物。参数控制（即，油墨流变学、聚合物-聚合物相互扩散、层倍增、相变和溶剂-聚合物相互作用）可以精确地调节层状-凹槽转变，从而形成所需的表面或内部微结构。通过异丙醇选择性湿法刻蚀，以107 -11 µg/s的刻蚀速率制备了分辨率为1055 -170 µm的微槽。我们的混合方法结合了自下而上的3D打印和自上而下的湿法蚀刻，促进了表面微图案化，并展示了分散氮化硼纳米颗粒以耗散热能的巨大潜力。微图案显示对于25 wt. BN，通过冷却剂的限制将散热提高了1011 °C。凭借生产可扩展性、操作简单性和多材料兼容性，我们的3D打印微图案化技术在纳米颗粒组装、药物输送、光学透镜、智能微机器人和变形物体等领域显示出更广泛的应用。Graphical AbstractionThis technology combines multiphase direct ink writing（MDIW）3D打印和湿蚀刻，能够在热管理应用中进行微图案化。
Micropatterned structures have applications in microchips, circuit board designs, microfluidics, evaporator/condenser coils, microelectronics, metasurfaces, and other functional devices. Conventional microfabrication techniques include lithography, vapor deposition, and laser writing. However, these methods have slow processing rates, complex requirements, or costly procedures. As a result, it is challenging to fabricate micropatterned structures onto large-scale surfaces with high production rates and resolution features. Thus, this study focuses on a non-conventional, mask-free micropatterning technique that combines bottom-up 3D printing capable of processing multiple materials and top-down wet etching for selective elimination of sacrificial material. The unique 3D printing, multiphase direct ink writing (MDIW), utilizes various polymer and nanoparticle systems as feedstocks for depositing lamellar structures containing 32–128 sublayers of varying compositions (i.e., wet etchable sacrificial ink and ultraviolet-curable patterning ink). The rapid phase transformation of photosensitive ink (i.e., epoxy and boron nitride (BN)) into solidified features enables “micro-confinement” of the sacrificial ink (i.e., polyethyleneimine). Subsequently, wet etching can locally and selectively dissolve sacrificial polymers by solvent diffusion and polymer dissolution at the polymer–solvent interface. The parameter control (i.e., ink rheology, polymer–polymer interdiffusion, layer multiplication, phase transformation, and solvent-polymer interactions) can precisely tune the lamellar-groove transition, thus forming desirable surfaces or internal microstructures. Microgrooves with a resolution of ≈ 55–170 µm were fabricated by selective wet etching via isopropanol with an etching rate of ≈ 7–11 µg/s. Our hybrid approach, which combines bottom-up 3D printing and top-down wet etching, facilitates surface micropatterning and demonstrates the massive potential of distributing boron nitride nanoparticles for dissipating thermal energies. The micropatterns displayed a thermal conductivity of ≈ 0.2 W/mK for 25wt.% BN with an enhancement of heat dissipation by ≈ 11 °C via confinement of coolants. With production scalability, operation simplicity, and multimaterial compatibility, our 3D-printed micropatterning shows broader applications in nanoparticle assembly, drug delivery, optical lenses, intelligent microbots, and morphing objects.Graphical AbstractThis technique combines multiphase direct ink writing (MDIW) 3D printing and wet etching capable of micropatterning for thermal management applications.