Effect of microstructural length scales on spall behavior of copper
Effect of microstructural length scales on spall behavior of copper
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DOI:
10.1007/s11661-004-0212-7
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发表时间:
2004-09
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影响因子:
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通讯作者:
R. Minich;J. Cazamias;Mulayam Kumar;A. Schwartz
中科院分区:
文献类型:
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作者:
R. Minich;J. Cazamias;Mulayam Kumar;A. Schwartz
A systematic study to quantify the effects of specific microstructural features on the spall behavior of 99.999 pct copper has revealed a strong dependence of the failure processes on length scale. Shock loading experiments with Cu flyer plates at velocities ranging from 300 to 2000 m/s (or impact pressures from 5 to 45 GPa) using a 35-mm single/two-stage light gas gun revealed that single crystals exhibit a higher spallation resistance than fine-grained polycrystals and internally oxidized single crystals. However, in contrast to previously reported results, the fine-grained (∼8-µm) polycrystalline samples exhibit lower damage resistance than the coarse-grained (50- and 133-µm) samples. These observations have been analyzed in the context of the length scale inherent in each of these microstructures, and modeled using an analytical model developed recently.