Microstructure evolution of Cu/Ag interface in the Cu-6 wt.% Ag filamentary nanocomposite
Microstructure evolution of Cu/Ag interface in the Cu-6 wt.% Ag filamentary nanocomposite
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DOI：
10.1016/j.actamat.2010.10.052
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发表时间：
2011-02-01
期刊：
影响因子：
9.4
通讯作者：
Meng, L.
中科院分区：
文献类型：
--
作者：
Liu, J. B.;Zhang, L.;Meng, L.
A Cu-6重量%采用熔融、时效、冷拉法制备了银纳米复合材料。研究了制备过程中的相形态变化和界面行为。在拉伸变形过程中，Ag析出相转变为丝状。在拉伸变形过程中，当丝径减小到2.0nm左右时，界面由半共格变为共格。根据最小能量原理分析了半共格界面向共格界面的演化过程。(C)2010 Acta Materialia Inc.由爱思唯尔有限公司出版。保留所有权利。
A Cu-6 wt.% Ag filamentary nanocomposite was prepared by melting, aging and cold drawing. The changes in phase morphology and interface behavior in the preparation process were investigated. The Ag precipitates evolve into filaments during drawing deformation. The interface changes into coherence from semi-coherence if the filament diameter decreases to similar to 2.0 nm during drawing deformation. The evolution of semi-coherent interface into coherent interface is analyzed on the basis of the minimum energy principle. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.