Novel low-κ polyimide/mesoporous silica composite films:: Preparation, microstructure, and properties
Novel low-κ polyimide/mesoporous silica composite films:: Preparation, microstructure, and properties
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DOI：
10.1016/j.polymer.2006.10.037
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发表时间：
2007-01-05
期刊：
影响因子：
4.6
通讯作者：
Wang, Xiaodong
中科院分区：
文献类型：
--
作者：
Lin, Jingjing;Wang, Xiaodong
通过原位聚合和热酰亚胺化，成功制备了一系列含有SBA-15或SBA-16型介孔二氧化硅的新型低介电常数（低K）聚酰亚胺（PI）复合薄膜。研究了它们的形态、介电常数以及热和动态机械性能。结果发现，通过掺入3 wt% SBA-15和7 wt% SBA-16，复合薄膜的介电常数可以从纯PI的3.34分别降低到2.73和2.61。介电常数的降低归因于介孔二氧化硅材料内存储的空气空隙（k = 1）、存在于介孔二氧化硅和PI基质之间的界面间隙中的空气体积以及通过引入大尺寸域而产生的自由体积。本研究制备的PI/介孔二氧化硅复合薄膜在较宽的频率范围内也表现出稳定的介电常数和良好的相互连。通过掺入介孔二氧化硅材料，可以提高PI薄膜的热稳定性和动态机械性能。经过表面处理的介孔二氧化硅和 PI 基质之间增强的界面相互作用，最大限度地减少了机械性能的恶化。掺入介孔二氧化硅材料是制备低卡伯 PI 薄膜的一种有前途的方法。 (c) 2006 Elsevier Ltd. 保留所有权利。
A series of novel low-dielectric constant (low-K) polyimide (PI) composite films containing the SBA-15 or the SBA-16-type mesoporous silica were successfully prepared via in situ polymerization and following thermal imidization. Their morphologies, dielectric constants, and thermal and dynamic mechanical properties were investigated. It is found that the dielectric constants of the composite films can be reduced from 3.34 of the pure PI to 2.73 and 2.61 by incorporating 3 wt% SBA-15 and 7 wt% SBA-16, respectively. The reduction of the dielectric constant is attributed to the incorporation of the air voids (k = 1) stored within the mesoporous silica materials, the air volume existing in the gaps on the interfaces between the mesoporous silica and the PI matrix, and the free volume created by introducing large-sized domains. The PI/mesoporous silica composite films prepared in this study also present stable dielectric constants across the wide frequency range and a good phase interconnection. The improvement of the thermal stability and dynamic mechanical properties of the PI film is achieved by incorporation of the mesoporous silica materials. The enhanced interfacial interaction between the surface-treated mesoporous silica and the PI matrix has led to the minimization of the deterioration of the mechanical properties. The incorporation of the mesoporous silica materials is a promising approach to prepare the low-kappa PI films. (c) 2006 Elsevier Ltd. All rights reserved.