Controlling coverage of solution cast materials with unfavourable surface interactions
Controlling coverage of solution cast materials with unfavourable surface interactions
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DOI：
10.1063/1.4867263
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发表时间：
2014-03
影响因子：
4
通讯作者：
V. Burlakov;G. Eperon;H. Snaith;S. Chapman;A. Goriely
中科院分区：
文献类型：
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作者：
V. Burlakov;G. Eperon;H. Snaith;S. Chapman;A. Goriely
溶液铸造材料的均匀涂层对于广泛的应用是至关重要的。在这里，一个强大的和通用的理论框架，计算表面覆盖的固体薄膜的材料脱湿的衬底提出。以半导体薄膜的实验数据为例，我们计算了大范围退火温度和薄膜厚度下的表面覆盖率。该模型一般预测，对于每一个退火温度值，都有一个导致表面覆盖率差的薄膜厚度范围。该模型准确地再现了有机金属卤化物钙钛矿（关键的现代光伏材料）的溶液铸造薄膜覆盖范围，并确定了高和低表面覆盖水平的加工窗口。
Creating uniform coatings of a solution-cast material is of central importance to a broad range of applications. Here, a robust and generic theoretical framework for calculating surface coverage by a solid film of material de-wetting a substrate is presented. Using experimental data from semiconductor thin films as an example, we calculate surface coverage for a wide range of annealing temperatures and film thicknesses. The model generally predicts that for each value of the annealing temperature there is a range of film thicknesses leading to poor surface coverage. The model accurately reproduces solution-cast thin film coverage for organometal halide perovskites, key modern photovoltaic materials, and identifies processing windows for both high and low levels of surface coverage.