Reactive vacuum vapor deposition of aluminum oxide thin films by an air-to-air metallizer
Reactive vacuum vapor deposition of aluminum oxide thin films by an air-to-air metallizer
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通过空对空镀膜机进行氧化铝薄膜的反应真空气相沉积
DOI:
10.1116/1.2198871
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发表时间:
2006
期刊:
影响因子:
--
通讯作者:
S. Kamikawa
中科院分区:
文献类型:
--
作者:
Toshiro Kobayashi;Y. Itoh;Y. Nakano;E. Hirai;R. Hashimoto;S. Kamikawa
Reactive vacuum vapor deposition of aluminum oxide thin films by an air-to-air metallizer was examined via the direct simulation Monte Carlo method and experiments. Comparison of the calculated results with the measurements of the Al oxide thin film’s thickness showed (a) that the empirical flux of Al atoms arriving at the substrate is lower than the calculated result, probably due to the formation of Al oxide on the evaporation surface and (b) that the amount of oxygen calculated from the thickness of the film is twice the amount corresponding to the calculated flux, probably due to the effects of the decreased sticking coefficient of oxygen on the evaporating surface and sidewall, underestimated gas phase reaction, large mesh size overestimated film density, and formation of substoichiometric oxide. Aluminum oxide thin films deposited on plastic film substrates by this metallizer under strictly controlled O2 supply conditions have good transparency, an oxygen transmission rate of 2.7cc∕m2day, and an ele...