Uniform groove-depths in (110) Si anisotropic etching by ultrasonic waves and application to accelerometer fabrication
Uniform groove-depths in (110) Si anisotropic etching by ultrasonic waves and application to accelerometer fabrication
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DOI:
10.1016/0924-4247(96)80090-2
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发表时间:
1995-08-01
影响因子:
4.6
通讯作者:
Oguchi, T
中科院分区:
文献类型:
--
作者:
Ohwada, K;Negoro, Y;Oguchi, T
The use of ultrasonic waves to obtain uniform groove depth in (110) Si anisotropic etching has been studied. Using dynashock-type ultrasonic waves, the frequency of which is switched between three frequencies at very short intervals, grooves with uniform depth can be successfully formed with widths of 1-20 mu m independently of pattern width and pattern spacing. This technology is applied to the fabrication of an accelerometer with comb-type narrow-gap electrodes. Comb electrodes with a minimum gap of 3.0 mu m and a height of 58 mu m can be formed uniformly, although they have different pattern widths and pattern spacings. The capacitance of this device has a high sensitivity to acceleration of 39 pF g(-1). By combining it with an output CV converter and amplifiers, we have produced a sensor with good full-scale linearity of 0.63% over the acceleration range 0 to + 2g.