MODELING OF SMART PATCH/LAYER JOINTS UNDER DYNAMIC TIME HARMONIC LOAD WITH INTERFACE DEFECT
MODELING OF SMART PATCH/LAYER JOINTS UNDER DYNAMIC TIME HARMONIC LOAD WITH INTERFACE DEFECT
复制标题
具有界面缺陷的动态时谐波载荷下智能补片/层接头的建模
DOI:
10.1002/cepa.548
复制
发表时间:
2017
期刊:
影响因子:
--
通讯作者:
J. Ivanova
中科院分区:
文献类型:
--
作者:
T. Petrova;W. Becker;E. Kirilova;J. Ivanova
The modified 1D shear lag analysis is applied to study the hygro‐thermal‐piezoelectric response of a smart patch/layer structure with and without an interface gap along the overlap zone at environmental conditions and under dynamic time harmonic and electrical loads. The overlap zone is divided into 3 parts – 2 of them belong to intact parts of the interface and 1 of them to the length of the gap. All three types of closed form analytical solutions are derived and obtained. The comparison of the model shear stress, electric gradient, stresses and debond length for both cases of the interface (continuous or with a gap) is done at an example of a PZT‐5H/CFRP structure. All results are shown in figures and discussed.
DOI:
--
发表时间:
1964
期刊:
影响因子:
--
作者:
D. Kutscha
通讯作者:
D. Kutscha
影响因子:
2.8
作者:
J. Ivanova;V. Valeva;T. Petrova;W. Becker
通讯作者:
W. Becker
DOI:
--
发表时间:
2017
期刊:
影响因子:
--
作者:
E. Kirilova;T. Petrova;W. Becker;J. Ivanova
通讯作者:
J. Ivanova