CERAMIC-FIBER POLYMER COMPOSITES FOR ELECTRONIC SUBSTRATES
CERAMIC-FIBER POLYMER COMPOSITES FOR ELECTRONIC SUBSTRATES
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DOI：
10.1016/0921-5093(89)90588-1
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发表时间：
1989-03-01
期刊：
影响因子：
6.4
通讯作者：
YOST, BA
中科院分区：
文献类型：
--
作者：
BOLT, JD;BUTTON, DP;YOST, BA
由某些陶瓷纤维增强的聚合物树脂层压复合材料在先进的微电子封装应用中表现出非常有利的性能组合。通过适当的设计，这些复合材料利用了聚合物的易于加工和理想的低介电常数以及陶瓷的高导热性和尺寸稳定性。除了选择合适的材料成分，复合材料设计中的其他关键考虑因素包括指定(1)所需性能的方向性和大小，以及(2)通过控制填料的形状、方向、加载和加工，在各种复合材料方向上的组件连接程度。我们报告了铝-纤维-聚酰亚胺复合材料的电学和热学性能作为纤维负荷的函数，并表明它们与理论预测一致。面内热导率和膨胀率主要由纤维决定，而面外介电常数与聚合物基体相当。更快，更密集的微电子设备被设想，结合聚合物的电气性能和陶瓷的热性能。
Laminate composites of polymer resins reinforced by certain ceramic fibers exhibit a very favorable combination of properties for advanced microelectronic packaging applications. With proper design, these composites utilize the ease of processing and desirably low dielectric constants of polymers and the high thermal conductivity and dimensional stability of ceramics. Besides selecting appropriate material components, other key considerations in composite design include specifying (1) the directionality as well as magnitude for desired properties, and (2) the degree of component connectivity in various composite directions by controlling filler shape, orientation, loading, and processing. We report electrical and thermal properties of alumina-fiber—polyimide composites as a function of fiber loading, and show their agreement with predictions from theory. The inplane thermal conductivities and expansivities are dominated by the fiber whereas the out-of-plane dielectric constant is comparable with the polymer matrix. Faster, denser microelectronic devices are envisioned, combining the electrical performance of polymers with the thermal performance of ceramics.