Application of thermal analysis in the selection of polymer components used as a binder for metal injection moulding of Co-Cr-Mo alloy powder
Application of thermal analysis in the selection of polymer components used as a binder for metal injection moulding of Co-Cr-Mo alloy powder
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DOI：
10.1007/s10973-018-7543-x
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发表时间：
2018-10-01
影响因子：
4.4
通讯作者：
Sotomayor, Maria Eugenia
中科院分区：
文献类型：
--
作者：
Matula, Grzegorz;Tomiczek, Blazej;Sotomayor, Maria Eugenia
为了生产用于注射成型的聚合物-粉末浆料，使用热塑性聚合物如聚丙烯、高密度聚乙烯和乙烯-乙酸乙烯酯。根据骨架聚合物，在每种原料中，石蜡（PW）以50%的粘合剂的量使用。PW的应用使溶剂脱脂或低温热脱脂成为可能。然后，注入样品中的开放孔隙减少了粘合剂残留物的热脱脂时间。一种类型的骨架聚合物的应用需要使用长的等温步骤。使用骨架聚合物的共混物能够实现随后的热降解，其在加热至烧结温度期间连续地去除骨架聚合物，以最小化等温停止的时间。采用双螺杆挤出机和毛细管流变仪研究了共混物作为粘结剂和后续原料在混炼过程中的流变性能。该结果给出了关于生产原料然后将其注射成型的可能性的信息。通过差示扫描量热法和热重分析确定样品的热行为，以获得关于混合聚合物的温度的信息，并提出热脱脂循环。
To produce the polymer-powder slurry for injection moulding the thermoplastic polymers such as polypropylene, high-density polyethylene and ethylene-vinyl acetate were used. Depending on skeletal polymers, in every feedstock paraffin wax (PW) was used in the amount of 50% of binder. Application of PW gives the possibility using solvent debinding or thermal debinding at a lower temperature. Then the open porosity into the injected samples reduces the time of thermal debinding of binder residue. Application of one type of skeletal polymer requires using a long isothermal step. The use of a blend of skeletal polymers enables subsequent thermal degradation which consecutively removes skeletal polymers during the heating to the sintering temperature, to minimise the time of isothermal stops. The rheological properties of blends used as a binder and next feedstocks were investigated during mixing in the twin-screw extruder and capillary rheometer. This results gives the information about the possibility to produce feedstocks and then to their injection moulding. Thermal behaviour of samples was determined by differential scanning calorimetry and thermogravimetric analysis to obtain the information about the temperature of mixing the polymers and to propose the thermal debinding cycle.