Chemomechanics of transfer printing of thin films in a liquid environment
Chemomechanics of transfer printing of thin films in a liquid environment
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DOI：
10.1016/j.ijsolstr.2019.07.011
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发表时间：
2019-12
影响因子：
3.6
通讯作者：
Yue Zhang;Bong-Joong Kim;Yuan Gao;Dae Seung Wie;Chi Hwan Lee;Baoxing Xu
中科院分区：
文献类型：
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作者：
Yue Zhang;Bong-Joong Kim;Yuan Gao;Dae Seung Wie;Chi Hwan Lee;Baoxing Xu
液体辅助转移印刷是一种新兴的具有竞争力的制造技术，用于薄膜层功能材料和结构的输送和组装。在本质上，这种技术是由在液体环境中的界面处的外部机械载荷和内部化学反应的协同效应下的薄膜的分离支撑的。在这里，我们已经开发了一个全面的化学力学理论的转移印刷薄膜从制造的SiO2/Si晶片基板在液态水环境。将液体分子与界面固体键界面处的动力学化学反应纳入薄膜剥离的界面能量释放速率中，得到了一个速率依赖的界面剥离过程。我们进一步耦合它与机械变形的薄膜，考虑到各种剥离条件，包括剥离速率，剥离角度和薄膜厚度的理论预测的稳态剥离力。此外，我们将此化学力学理论应用到一个包含所有原子信息的有限元模型中，并提出了一个反应原子-连续介质多尺度模型来模拟连续介质尺度下的薄膜分离过程。平行地，我们已经进行了剥离实验的三个不同的分离层在晶片基板上在干燥的空气和水的条件。理论预测，模拟结果和实验测量之间的定量比较，并获得良好的一致性。分析了剥离过程中界面脱层与薄膜机械变形之间的竞争，给出了理论相图，为硅纳米膜的转移印刷在功能结构和电子器件制造中的应用提供了直接指导。此外，由于材料的表面润湿性的毛细管力进行了讨论，并与化学反应引起的驱动力转移印刷在广泛的薄膜/基板系统。所建立的化学力学理论和反应性原子连续模拟模型有望为定量理解和描述液体环境中薄膜的转印过程奠定基础。
The liquid-assisted transfer printing is emerging as a competitive manufacturing technique in the delivery and assembly of thin film-layered functional materials and structures. In essence, this technique is underpinned by the detachment of thin films under a synergistic effect of external mechanical loading and interior chemical reaction at interfaces in a liquid environment. Here, we have developed a comprehensive chemomechanics theory for the transfer printing of thin films from as-fabricated SiO2/Si wafer substrate in a liquid water environment. The kinetic chemical reaction at the interface of liquid molecules and interfacial solid bonds is incorporated into the interface energy release rate of thin film detachment, and a rate dependent interfacial debonding process is obtained. We further couple it with mechanical deformation of thin films by taking into account various peeling conditions including peeling rate, peeling angle and thin film thickness to theoretically predicate the steady-state peeling force. Besides, we implement this chemomechanics theory into a finite element model with all atomic information informed and present a reactive atomistic-continuum multiscale model to simulate the detachment of thin films at the continuum scale. In parallel, we have conducted the peeling experiments of three different separation layers on wafer substrates in both dry air and water conditions. Quantitative comparisons among theoretical predictions, simulation results, and experimental measurements are performed and good agreement is obtained. The competition between interfacial delamination and mechanical deformation of thin films during peeling is also analyzed, and a theoretical phase diagram is given to provide an immediate guidance for transfer printing of silicon nanomembranes in the fabrication of functional structures and electronic devices. In addition, the capillary force due to surface wettability of materials is discussed and compared with chemical reaction-induced driving force for transfer printing on a wide range of thin film/substrate systems. The chemomechanics theory and reactive atomistic-continuum simulation model established are expected to lay a foundation for quantitative understanding and descriptions of transfer printing of thin films in a liquid environment.