Numerically-quantified two dimensionality of microstructure evolution accompanying variant selection of FePd

Numerically-quantified two dimensionality of microstructure evolution accompanying variant selection of FePd
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伴随 FePd 变体选择的微观结构演化的二维数值量化

DOI:
10.1088/2053-1591/2/7/076502
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发表时间:
2015
影响因子:
2.3
通讯作者:
T. Kakeshita
T. Kakeshita
中科院分区:
材料科学4区
文献类型:
--
作者:
N. Ueshima;M. Yoshiya;H. Yasuda;T. Fukuda;T. Kakeshita

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通过相场建模(PFM)对微观结构演化过程的三维模拟,利用图像处理技术对微观结构在时间演化过程中进行了量化,并在变体选择过程中特别关注变体的形状。研究发现,由于在无序向L10相转变时,变体周围存在弹性场,新变体呈现平面形状而不是三维形状。随着变异选择的进行,这种二维性更加明显。虽然三种等效变异体在外场作用下竞争优势,但在剩余变异体最终竞争之前,其中一种变异体会消失,这可以用弹性应变能来解释。这些数值分析以更定量的方式更好地了解微观结构演变,包括第三种变体的小影响,所获得的结果证实了PFM从二维(2D)模拟中获得的变体选择的理解是有效的。
Through three-dimensional (3D) simulations of microstructure evolution by phase-field modeling (PFM), microstructures have been quantified during their time evolution by an image processing technique with particular attention to the shape of variants in the course of variant selection. It is found that the emerging variants exhibit planar shapes rather than 3D shapes due to the elastic field around the variants arising upon disorder-to-order transition to the L10 phase. The two-dimensionality is more pronounced as variant selection proceeds. Although three equivalent variants compete for dominance under an external field, one of the three variants vanishes before final competition occurs between the remaining variants, which can be explained by the elastic strain energy. These numerical analyses provide better understanding of the microstructure evolution in a more quantitative manner, including the small influence of the third variant, and the results obtained confirm that the understanding of variant selection obtained from two-dimensional (2D) simulations by PFM is valid.
通过相场建模对磁场对 FePd 变体选择的有效性进行数值分析
DOI: 10.2355/isijinternational.50.1908
发表时间: 2010
期刊: ISIJ International
影响因子: 1.8
作者:
N. Ueshima;M. Yoshiya;H. Yasuda
通讯作者: H. Yasuda
通过磁场下的有序热处理实现 L1_0 型 CoPt 变体的选择性形成
DOI: --
发表时间: 2008
期刊: Scr. Mater 58
影响因子: --
作者:
S. Farjami;M. Yasui;T. Fukuda;T. Kakeshita
通讯作者: T. Kakeshita