Investigation of surface near residual stress states after micro-cutting by finite element simulation
Investigation of surface near residual stress states after micro-cutting by finite element simulation
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DOI：
10.1016/j.cirp.2010.03.064
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发表时间：
2010-01-01
影响因子：
4.1
通讯作者：
Weule, H.
中科院分区：
文献类型：
--
作者：
Schulze, V.;Autenrieth, H.;Weule, H.
表面层性质，即残余应力、表面加工硬化和表面粗糙度，对零件的使用寿命有很大影响。特别是切削后表面层的残余应力状态非常重要，并显示出很强的材料特性。因此，残余应力对切削刃半径的依赖性，这起着至关重要的作用，微切削，研究在芯片形成模拟使用ABAQUS/标准。残余应力状态的参考材料标准化AISI 1045进行评估，并与代表硬化材料状态的模型材料进行比较。通过系统地分离导致切削后材料特定残余应力状态的物理效应，将增加工艺知识。模拟结果与实验确定的残余应力深度分布，使用X射线衍射方法进行比较，显示出良好的相关性。(C)2010年CIRP。
Surface layer properties, namely residual stresses, surface work hardening and surface roughness, have a great influence on the service life of components. Especially the residual stress state of the surface layer after cutting is of great importance and shows a strong material specific behavior. Therefore the dependence of the residual stresses on the cutting edge radius, which plays a crucial role for micro-cutting, is investigated in chip forming simulations using ABAQUS/Standard. The residual stress states are evaluated for the reference material normalized AISI 1045 and are compared with a model material representing a hardened material state. The process knowledge will be increased by the systematic separation of physical effects leading to material specific residual stress states after cutting. The simulation results are validated by the comparison with experimentally determined residual stress depth profiles, using X-ray diffraction method, showing a good correlation. (C) 2010 CIRP.