500 microkelvin nanoelectronics

500 microkelvin nanoelectronics
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500微开尔文纳米电子学

DOI:
10.1038/s41467-020-15201-3
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发表时间:
2019
影响因子:
16.6
通讯作者:
A. Geresdi
A. Geresdi
中科院分区:
综合性期刊1区
文献类型:
--
作者:
M. Sarsby;N. Yurttagül;A. Geresdi

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量子点中的单电子充电或超导结中的宏观相干隧穿等脆弱量子效应是现代量子技术的基础。这些现象只能在能级之间的特征间距超过热能kBT的设备中观察到,这需要纳米级电子设备的有效制冷技术。市售的稀释制冷机已经实现了10至100 mK范围内的典型电子温度,然而,由于杂散射频加热和电子与器件衬底的弱热耦合,纳米器件的间接冷却变得低效。在这里,我们报告通过毫开尔文障碍的纳米电子器件。采用片上和片外核制冷相结合的方法,用自校准库仑阻塞温度计测量,在700 μK以下,最终电子温度达到Te = 421 ± 35 μK,保持时间超过85 h。将冰箱的低温极限推到毫开尔文以上,有望在纳米电子器件方面取得新的发现。在这里,Sarsby等人使用组合的片上和片外核制冷技术实现了500微开尔文的电子温度。
Fragile quantum effects such as single electron charging in quantum dots or macroscopic coherent tunneling in superconducting junctions are the basis of modern quantum technologies. These phenomena can only be observed in devices where the characteristic spacing between energy levels exceeds the thermal energy, kBT, demanding effective refrigeration techniques for nanoscale electronic devices. Commercially available dilution refrigerators have enabled typical electron temperatures in the 10 to 100 mK regime, however indirect cooling of nanodevices becomes inefficient due to stray radiofrequency heating and weak thermal coupling of electrons to the device substrate. Here, we report on passing the millikelvin barrier for a nanoelectronic device. Using a combination of on-chip and off-chip nuclear refrigeration, we reach an ultimate electron temperature of Te = 421 ± 35 μK and a hold time exceeding 85 h below 700 μK measured by a self-calibrated Coulomb-blockade thermometer. Pushing the low temperature limit of refrigerators beyond milli-kelvin regime holds the promise for new discoveries in the nano-electronic devices. Here, Sarsby et al. achieve 500 micro-kelvin electron temperature using combined on-chip and off-chip nuclear refrigeration techniques.
纳米电子器件的片上磁冷却
DOI: 10.48550/arxiv.1611.02483
发表时间: 2016
期刊: --
影响因子: --
作者:
Bradley D
通讯作者: Bradley D
低温低通滤波器的比较
DOI: 10.1063/1.4995076
发表时间: 2017
期刊: The Review of scientific instruments
影响因子: --
作者:
M. Thalmann;H.-F. Pernau;Ch. Strunk;E. Scheer;T.Pietsch
通讯作者: T.Pietsch