Thermomechanical responses in metal films under mechanical shock: A molecular dynamics study
Thermomechanical responses in metal films under mechanical shock: A molecular dynamics study
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DOI：
10.1080/01495739.2019.1647123
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发表时间：
2019-08
影响因子：
2.8
通讯作者：
Q. Xiong;T. Kitamura;Zhenhua Li
中科院分区：
文献类型：
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作者：
Q. Xiong;T. Kitamura;Zhenhua Li
摘要采用分子动力学方法模拟了金属薄膜的一系列动态冲击压缩过程。从理论上分析了机械冲击载荷的特性。用图形表示了机械冲击引起的热力响应，包括压力、温度、体积应变和剪切应变，并从热力耦合的角度进行了分析。结果表明，体积应变（弹性）引起的温升是可逆的，而剪切应变引起的温升是不可逆的。在相同的机械冲击载荷下，几种金属薄膜的热力学响应存在显著差异，并从热物理参数的差异分析其可能的原因。
Abstract A series of dynamic shock compressions of metal films are simulated using molecular dynamics method. Characteristics of mechanical shock load are analyzed theoretically. Thermomechanical responses induced by mechanical shock, including pressure, temperature, volumetric strain, and shear strain, are presented graphically and analyzed from viewpoint of thermomechanical coupling. The results show that the temperature rise caused by volumetric strain (elastic) is reversible, while that caused by shear strain is irreversible. Under the same mechanical shock load, several metal films exhibit significant differences in thermomechanical responses and the potential reasons are analyzed from the differences of thermophysical parameters.