Monolithic 3D Integrated Circuits: Recent Trends and Future Prospects
Monolithic 3D Integrated Circuits: Recent Trends and Future Prospects
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DOI：
10.1109/tcsii.2021.3051250
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发表时间：
2021-03-01
影响因子：
4.4
通讯作者：
Salman, Emre
中科院分区：
文献类型：
--
作者：
Dhananjay, Krithika;Shukla, Prachi;Salman, Emre
单片3D集成技术已经成为传统晶体管缩放的替代候选者。与在单个晶体管层上方制造多个金属层的传统工艺不同，单片3D技术能够在单个衬底上方实现多个晶体管层。通过提供物理尺寸与传统金属过孔相似的垂直互连，单片3D技术实现了前所未有的集成密度和高带宽通信，这对于各种以数据为中心的应用至关重要。尽管在单片3D集成的各个方面的研究工作越来越多，但商业单片3D IC还不存在。本教程简要介绍了单片3D技术的简要概述，重点介绍了重要成果和未来前景。还讨论了可能从该技术中受益的几个应用。
Monolithic 3D integration technology has emerged as an alternative candidate to conventional transistor scaling. Unlike conventional processes where multiple metal layers are fabricated above a single transistor layer, monolithic 3D technology enables multiple transistor layers above a single substrate. By providing vertical interconnects with physical dimensions similar to conventional metal vias, monolithic 3D technology enables unprecedented integration density and high bandwidth communication, which plays a critical role for various data-centric applications. Despite growing number of research efforts on various aspects of monolithic 3D integration, commercial monolithic 3D ICs do not yet exist. This tutorial brief provides a concise overview of monolithic 3D technology, highlighting important results and future prospects. Several applications that can potentially benefit from this technology are also discussed.