Modified SAMs and templates for achieving self-alignment of full wafers

Modified SAMs and templates for achieving self-alignment of full wafers
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DOI:
10.1007/s10404-020-02352-4
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发表时间:
2020-06-10
影响因子:
2.8
通讯作者:
Hallen, Hans D.
Hallen, Hans D.
中科院分区:
工程技术3区
文献类型:
--
作者:
Emanuel, Ako;Walker, Ernest M., III;Hallen, Hans D.

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超过几毫米大小的结构的自组装是当前的一个问题,它可以在构建我们使用的物体的新方法中有广泛的应用。作为朝这个方向迈出的一步,在晶圆到晶圆水平的流体自对准进行了演示,表征和建模。虽然毫米级物体的自对准先前已经被证明,但随着结构尺寸增加到整个晶圆,几个物理过程变得重要。本文对这些过程进行了测量和建模。自组装的单层,无论是天然的还是经过氧化修饰的,都被用来产生表面能梯度,用于产生毛细排列力。这些力超过了晶圆边缘力。在没有可调参数的情况下,对测量的毛细管流体剖面进行建模以预测对准力。校准力是测量和趋势预测,因为液体的表面张力,因此产生的力,是变化的。这些考虑因素支配着图案设计规则,这些规则被描述并确保长捕获范围,高对齐力,并避免晶圆边缘拖拽。
Self-assembly of structures that are more than a few millimeters in size is a current problem that can have broad applications in new ways to construct the objects that we use. As a step in that direction, fluidic self-alignment at the wafer-to-wafer level is demonstrated, characterized, and modeled. Although self-alignment of millimeter-sized objects has previously been shown, several physical processes become important as the structure size is increased to a whole wafer. These processes are measured and modeled in this paper. Self-assembled monolayers, both natural and modified by oxidation, are used to create surface energy gradients that are used to produce capillary alignment forces. These forces exceed the wafer-edge forces. The measured capillary fluid profile is modeled to predict the alignment forces with no adjustable parameters. Alignment forces are measured and the trends are predicted as the surface tension of the liquid, hence the generated force, is varied. These considerations govern pattern design rules, which are described and ensure a long capture range, high alignment force, and avoidance of wafer-edge dragging.[GRAPHICS].