Fine tuning of the interaction between the copper(I) and disulfide bond. Formation of a bis(mu-thiolato)dicopper(II) complex by reductive cleavage of the disulfide bond with copper(I).
Fine tuning of the interaction between the copper(I) and disulfide bond. Formation of a bis(mu-thiolato)dicopper(II) complex by reductive cleavage of the disulfide bond with copper(I).
复制标题
微调铜（I）和二硫键之间的相互作用。
DOI：
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发表时间：
2001
影响因子：
15
通讯作者：
S. Fukuzumi
中科院分区：
文献类型：
--
作者：
S. Itoh;M. Nagagawa;S. Fukuzumi
