Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles
Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles
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DOI：
10.1016/j.msea.2018.12.015
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发表时间：
2019-01
期刊：
影响因子：
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通讯作者：
X. Long;Zhen Li;Xiuzhen Lu;Hongcun Guo;Chang Chao;Qianran Zhang;A. Zehri;W. Ke;Yao Yao-Yao;
中科院分区：
文献类型：
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作者：
X. Long;Zhen Li;Xiuzhen Lu;Hongcun Guo;Chang Chao;Qianran Zhang;A. Zehri;W. Ke;Yao Yao-Yao;
将不同重量比（0.0、0.5、1.0和1.5wt%）的SiC微粒掺入到烧结的银纳米颗粒（AgNP）中，作为用于大功率电子器件的有前途的封装材料之一。基于纳米压痕实验和解析方法研究了SiC微粒增强AgNP烧结体的力学性能和本构行为。以连续刚度测量的方式进行纳米压痕，最大穿透深度为2000 nm，应变速率为0.05 s-1。特别地，利用布氏压头来评估杨氏模量和硬度的值，并且利用球形压头来描述本构行为。对于含有0.5wt%SiC的烧结AgNP，其形貌表现出均匀致密的微观结构，从而能够优化热导率，烧结AgNP材料的屈服强度和硬化能力得到增强。为了描述本构行为，提出了一种分析方法来模拟压痕行为。修正的幂律模型中的参数通过拟合平均压痕响应来确定。微观结构和宏观性能之间的相关性的发展，有利于AgNP浆料形态的设计，并提高电子封装中的烧结AgNP的机械性能。
SiC microparticles with various weight ratios (0.0, 0.5, 1.0 and 1.5 wt%) are incorporated into sintered silver nanoparticles (AgNP) as one of the promising packaging materials for high-power electronic devices. Mechanical properties and constitutive behaviour of sintered AgNP reinforced by SiC microparticles are investigated based on nanoindentation experiment and analytical approach. Nanoindentations were performed in the manner of continuous stiffness measurement for a maximum penetration depth of 2000 nm at a strain rate of 0.05 s−1. Particularly, a Berkovich indenter is utilized to evaluate the values of Young's modulus and hardness, and a spherical indenter is utilized to describe the constitutive behaviour. For sintered AgNP with 0.5 wt% SiC, the morphology exhibits uniformly compact microstructures to enable optimizing the heat conductivity, the yield strength and hardening capacity of sintered AgNP material is enhanced. To describe the constitutive behaviour, an analytical approach is proposed to simulate the indentation behaviour. The parameters in the modified power-law model are determined by fitting the average indentation responses. The developed correlation between microstructure and macroscopic properties facilitates the design of AgNP paste morphology and improves the mechanical properties of sintered AgNP in electronics packaging.