Mechanisms and potential therapeutic applications of microglial activation after brain injury.

Mechanisms and potential therapeutic applications of microglial activation after brain injury.
复制标题

DOI:
10.1111/cns.12360
复制
发表时间:
2015-04
影响因子:
5.5
通讯作者:
Yenari MA
Yenari MA
中科院分区:
医学1区
文献类型:
--
作者:
Kim JY;Kim N;Yenari MA

文献摘要

参考文献

被引文献

相似文献

作为中枢神经系统的常驻免疫细胞,小胶质细胞对脑损伤(包括中风和创伤性脑损伤)迅速作出反应。小胶质细胞活化通过释放多种炎症和神经毒性介质在神经元细胞损伤和死亡中起主要作用。它们的激活是一种早期反应,可能会加剧脑损伤和许多其他应激源,特别是在急性期,但对大脑恢复和修复也至关重要。小胶质细胞活动的全部范围仍然没有完全了解,但关于它们在脑损伤后的作用的知识正在积累。我们回顾了最近的进展有关的有害和有益的影响,小胶质细胞在急性神经损伤的设置,以及目前的文献周围的药物干预干预。
As the resident immune cells of the central nervous system, microglia rapidly respond to brain insults, including stroke and traumatic brain injury. Microglial activation plays a major role in neuronal cell damage and death by releasing a variety of inflammatory and neurotoxic mediators. Their activation is an early response that may exacerbate brain injury and many other stressors, especially in the acute stages, but are also essential to brain recovery and repair. The full range of microglial activities is still not completely understood, but there is accumulating knowledge about their role following brain injury. We review recent progress related to the deleterious and beneficial effects of microglia in the setting of acute neurological insults, and the current literature surrounding pharmacological interventions for intervention.
DOI: 10.1038/77528
发表时间: 2000-07-01
期刊: NATURE MEDICINE
影响因子: 82.9
作者:
Chen, M;Ona, VO;Friedlander, RM
通讯作者: Friedlander, RM
DOI: 10.1038/jcbfm.2010.231
发表时间: 2011-06-01
影响因子: 6.3
作者:
Brea, David;Blanco, Miguel;Castillo, Jose
通讯作者: Castillo, Jose
DOI: 10.1161/circulationaha.106.603431
发表时间: 2007-03-27
期刊: CIRCULATION
影响因子: 37.8
作者:
Caso, Javier R.;Pradillo, Jesus M.;Lizasoain, Ignacio
通讯作者: Lizasoain, Ignacio
DOI: 10.1111/j.1742-7843.2007.00082.x
发表时间: 2007-08-01
影响因子: 3.1
作者:
Chen, Chang-Mu;Liu, Shing-Hwa;Lin-Shiau, Shoei-Yn
通讯作者: Lin-Shiau, Shoei-Yn
DOI: 10.1038/sj.jcbfm.9600058
发表时间: 2005-04-01
影响因子: 6.3
作者:
Cho, S;Park, EM;Iadecola, C
通讯作者: Iadecola, C