Ex situ and in situ measurements of the shear strength of interfaces in metallic multilayers
Ex situ and in situ measurements of the shear strength of interfaces in metallic multilayers
复制标题
DOI：
10.1016/j.scriptamat.2012.06.008
复制
发表时间：
2012-09
影响因子：
6
通讯作者：
Nan Li;N. Mara;Jian Wang;P. Dickerson;J. Huang;A. Misra
中科院分区：
文献类型：
--
作者：
Nan Li;N. Mara;Jian Wang;P. Dickerson;J. Huang;A. Misra
由于界面中的原子通常具有较低的配位键，因此与完美晶粒相比，界面在剪切和脱键方面通常较弱。在这篇文章中，我们报告了用定量的非原位和原位压痕对Cu-Nb界面抗剪强度的实验测量。实验估计界面抗剪强度在0.3 ~ 0.55 gpa之间，这与原子模拟结果一致，是金属多层材料弱界面强化机制的证据。
Interfaces are generally weaker in terms of shearing and debonding in comparison to perfect grains since atoms within interfaces usually have low coordination bonds. In this letter, we report the experimental measurements of the shear strength of Cu–Nb interfaces by using quantitative ex situ and in situ indentations. The interface shear strength is estimated from experiments in the range of 0.3–0.55GPa, which is consistent with atomistic simulations and evidence of the weak interface strengthening mechanisms in metallic multilayers.