Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics
Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics
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DOI：
10.1039/c4ra00292j
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发表时间：
2014-01-01
期刊：
影响因子：
3.9
通讯作者：
Schroder, Kurt A.
中科院分区：
文献类型：
--
作者：
Cui, Hui-Wang;Jiu, Jin-Ting;Schroder, Kurt A.
为了避免高温和长固化时间，这两者在柔性印刷电子器件的制造中都是不切实际的，我们使用乙烯基酯树脂和银微片制造了新的导电粘合剂，并在室温下在环境气氛下引入强光脉冲以固化粘合剂。导电乙烯基酯树脂-银薄片胶粘剂能吸收强脉冲光，使树脂中的双键发生交联固化。这种固化过程称为光子固化，可以在室温下的环境气氛下在一秒钟内完成大面积。在粘合剂中没有任何光敏剂或光引发剂的情况下，典型的固化时间为140 ms。固化后的导电胶具有较低的体积电阻率，例如，在一个实施例中，7.54 Chi 10（-6）Ω cm和高粘结强度，e.例如，在一个实施例中，6.75 MPa.因此，光子固化和导电乙烯基酯树脂-银微片粘合剂的组合对于需要基于柔性器件的低温和快速工艺的印刷电子产品具有巨大的潜力。
To avoid high temperatures and long curing times, both of which are impractical in the manufacture of flexible printed electronic devices, we fabricated new electrically conductive adhesives using vinyl ester resin and silver micro-flakes and introduced an intense pulse of light to cure the adhesives under an ambient atmosphere at room temperature. The electrically conductive vinyl ester resin-silver microflake adhesives can absorb intense pulsed light, which initializes the double bonds in the resin to successfully achieve crosslinking and curing. This curing process, known as photonic curing, can be completed within a second under an ambient atmosphere at room temperature, over a large area. A typical curing time was 140 ms without any photosensitizers or photoinitiators in the adhesives. The cured conductive adhesives had low bulk resistivity, e. g., 7.54 Chi 10(-6) Omega cm and high bonding strength, e. g., 6.75 MPa. Thus, the combination of photonic curing and electrically conductive vinyl ester resin-silver micro-flake adhesives has great potential for printed electronics, which require low temperature and fast processes based on flexible devices.