Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging
Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging
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DOI：
10.1016/j.scriptamat.2013.08.031
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发表时间：
2013-12-01
影响因子：
6
通讯作者：
Wang, Chunqing
中科院分区：
文献类型：
--
作者：
Wang, Shuai;Li, Mingyu;Wang, Chunqing
本文介绍了一种实现键合用纳米银颗粒快速无压低温烧结的方法。吸附在银纳米颗粒表面以稳定它们的有机壳层被减薄，形成稀疏的保护层。颗粒尺寸为21微米的烧结银纳米颗粒中形成的大量共格孪晶界导致了超高的热导率(229Wm(-1)K-1)，克服了纳米晶金属由于晶界散射效应而导致导热系数显著降低的固有缺陷。(C)2013 Acta Materialia Inc.由Elsevier Ltd.出版。保留所有权利。
This paper describes a method to achieve rapid pressureless low-temperature sintering of Ag nanoparticles for bonding. Organic shells adsorbing on the surface of Ag nanoparticles to stabilize them were thinned to create a sparse protecting layer. The numerous coherent twin boundaries formed in sintered Ag nanoparticles with a grain size of 21 mu induce ultrahigh thermal conductivity (229 W m(-1) K-1), which overcomes the intrinsic defect that metals with nanosized grains generally exhibit a significantly reduced thermal conductivity because of the grain boundary scattering effect. (C) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.