Laser micro sintering - a quality leap through improvement of powder packing
Laser micro sintering - a quality leap through improvement of powder packing
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激光微烧结——粉末填充改进的品质飞跃
DOI：
10.26153/tsw/7273
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发表时间：
2008
影响因子：
3.9
通讯作者：
Fachbereich Mpi
中科院分区：
文献类型：
--
作者：
A. Streek;P. Regenfuß;R. Ebert;H. Exner;Fachbereich Mpi
激光微细烧结技术是在选择性激光烧结技术的基础上发展起来的一种用于制造微细零件的新型材料，自首次应用以来不断升级。粉末层密度差一直是一个长期存在的问题，必须从一开始就加以解决。一种解决方案是应用高强度调Q激光脉冲。实现了原料的致密化和烧结矿分辨率的提高。但在这些脉冲状态下，只能获得有限密度的烧结体。最近，已经做出了特别的努力，通过显著提高各粉料层的压实度来消除或至少减少这些缺点。有明确的证据表明，在粉末层足够致密的情况下，即使是连续辐射的激光微细烧结也是可行的。直到最近，金属的激光烧结主要应用于生产整体式零件。有了升级后的技术，可以直接产生具有可自由移动组件的微型设备。
Laser micro sintering, a modification of selective laser sintering for freeform fabrication of micro-parts, was continuously upgraded since its first application. Poor density of the powder layers has been a persisting problem that had to be dealt with from the beginning. One solution was the application of high intensity q-switched laser pulses. Compaction of the material and improvement of the sinter resolution was achieved. But with these pulse-regimes only limited density of the sintered body has been achievable. Recently special efforts have been made to get rid of or at least reduce these drawbacks by markedly higher compaction of the respective powder layers. There is clear evidence that with sufficiently compacted powder layers even laser micro sintering with continuous radiation should be feasible. Till recently laser sintering of metal had been applied mainly to produce monolithic components. With the upgraded technique direct generation of micro devices with freely movable subassemblies can be possible.