Error sources in in-plane silicon tuning-fork MEMS gyroscopes
Error sources in in-plane silicon tuning-fork MEMS gyroscopes
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DOI：
10.1109/jmems.2006.876779
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发表时间：
2006-06-01
影响因子：
2.7
通讯作者：
Kourepenis, Anthony
中科院分区：
文献类型：
--
作者：
Weinberg, Marc S.;Kourepenis, Anthony
本文分析了定义硅、面内音叉陀螺仪战术级性能的误差源，例如交付军事应用的霍尼韦尔-德雷珀单元。这些分析还没有出现在文献中。这些单元结合了阳极法结合到玻璃基板上的晶硅。在对音叉式陀螺仪进行总体描述后，分析了陀螺仪的阶跃模态频率、基本动力学、力和流体耦合，它们决定了真空封装、机械正交化和电耦合的必要性。通过介绍成功的商业产品Systron Donner/BEI石英速率传感器和专为汽车应用设计的模拟器件(ADXRS)，讨论了处理这些工程问题的替代策略。
This paper analyzes the error sources defining tactical-grade performance in silicon, in-plane tuning-fork gyroscopes such as the Honeywell-Draper units being delivered for military applications. These analyses have not yet appeared in the literature. These units incorporate crystalline silicon anodically bonded to a glass substrate. After general descriptions of the tuning-fork gyroscope, ordering modal frequencies, fundamental dynamics, force, and fluid coupling, which dictate the need for vacuum packaging, mechanical quadrature, and electrical coupling are analyzed. Alternative strategies for handling these engineering issues are discussed by introducing the Systron Donner/BEI quartz rate sensor, a successful commercial product, and the Analog Device (ADXRS), which is designed for automotive applications.