Development of Low-Power dc-SQUIDs for TES Frequency-Division Multiplexing Readout towards Future Space Missions

Development of Low-Power dc-SQUIDs for TES Frequency-Division Multiplexing Readout towards Future Space Missions
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开发用于未来太空任务 TES 频分复用读出的低功耗 dc-SQUID

DOI:
10.1109/isec.2015.7383451
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发表时间:
2015
期刊:
Superconductive Electronics Conference (ISEC), 2015 15th International
影响因子:
--
通讯作者:
S.Kohjiro
S.Kohjiro
中科院分区:
--
文献类型:
--
作者:
K.Sakai;R.Yamamoto;Y.Takei;N.Y.Yamasaki;K.Mitsuda;T.Miyazaki;M.Hidaka;S.Nagasawa;S.Kohjiro

文献摘要

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我们正在开发低功率dc- squid,用于读取TES x射线微热量计阵列的频分复用(FDM),用于未来的x射线卫星任务。在未来的太空任务中,具有数百到数千像素的大画幅TES x射线微热计阵列是同时实现高能量分辨率和高空间分辨率的有前途的探测器。为了在低温阶段以有限的冷却功率读出如此大格式的阵列,TES像素在频域进行多路复用,并使用散热小的squid读出。我们正在开发具有足够增益和低噪声特性的低功率dc- squid,用于TES FDM读出。凭借这些功能,SQUID可以足够成为冷电子器件中唯一的放大器,即使它可以放置在低于100 mK的低温级,实现简单的单级低温配置。利用低功耗SQUID,我们正在开发内置带通滤波器的多输入SQUID芯片,用于FDM中的信道分离。在2.5×2.5毫米的尺寸内,它携带了低功耗SQUID, TES分流电阻和四个通道的LC带通滤波器。我们还在开发一种同样大小的扩展芯片,该芯片由另外四个通道的带通滤波器组成,并且只需两根键合线即可连接到多输入SQUID芯片上。有了这些芯片,低温级的设置就大大简化了。讨论了squid的设计和实验结果。
We are developing low-power dc-SQUIDs to read out TES X-ray microcalorimeter arrays with frequency-division multiplexing (FDM) towards future X-ray satellite missions. In future space missions, large-format TES X-ray microcalorimeter arrays with hundreds to thousands of pixels are promising detectors achieving high energy resolution and high spatial resolution at the same time. To read out such a large-format array with a limited cooling power at the cryogenic stage, TES pixels are multiplexed in the frequency domain and read out using SQUIDs with small heat dissipations. We are developing low-powered dc-SQUIDs with an adequate gain and a low noise characteristic for TES FDM readouts. With these features, the SQUID can suffice to be the only amplifier in the cold electronics even though it can be placed at the cryogenic stage below 100 mK, enabling a simple single-staged cryogenic configuration. Using the low-power SQUID, we are developing multi-input SQUID chips with built-in bandpass filters used for the channel separation in FDM. Within the size of 2.5×2.5 mm, it carries the low-power SQUID, a TES shunt resistor, and LC bandpass filters for four channels. We are also developing a same-size extension chip that consists of the bandpass filters for four other channels, and it can be attached to the multi-input SQUID chip with only two bonding wires. With these chips, the cryogenic stage setup is drastically simplified. The designs and experimental results of the SQUIDs will be discussed.