New Microscopic Polishing with Magnetic Compound Fluid (MCF)
New Microscopic Polishing with Magnetic Compound Fluid (MCF)
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新型磁性复合流体 (MCF) 显微抛光
DOI：
10.1106/104538902026159
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发表时间：
2002
影响因子：
2.7
通讯作者：
Astushi Shibayama
中科院分区：
文献类型：
--
作者：
K. Shimada;Y. Akagami;S. Kamiyama;T. Fujita;T. Miyazaki;Astushi Shibayama
提出了一种新型智能流体--磁性复合流体（MCF）.该流体包括在溶剂中的nm尺寸的磁铁矿和mm尺寸的铁颗粒。磁流体与磁流变液之间有望表现出磁效应。此外，通过改变磁场与磁流变液的复合率，可以使稳态磁场下剪切应力对剪切速率的影响大于磁流变液。这份报告显示了一个实验应用的显微抛光与MCF。我们检测了在磁场下以15 rpm旋转的平板钛材料的表面粗糙度。通过比较MCF和MR之间的粗糙度，具有MCF的抛光板比MR的抛光板更均匀。此外，Ry和Ra的粗糙度在波动磁场下比稳定磁场下更大。抛光效率的提高可以用颗粒的团簇模型来解释。
We propose a magnetic compound fluid (MCF) as a new smart fluid. This fluid includes nm size magnetite and mm size iron particles in a solvent. The magnetic effect can be expected to demonstrate between the magnetic fluid (MF) and magneto-rheological fluid (MRF). Moreover, the magnitude of the shear stress to the shear rate under steady magnetic field can be larger than MRF by varying the compound rate of the MF and MRF. This report shows an experimental application of microscopic polishing with the MCF. We examined the surface roughness of flat titanium material to the attached rotating plate with 15 rpm under magnetic field. By comparing the roughness between the MCF and the MR, the polished plate is more uniformly over the plate with the MCF than the MR. Further the roughness of Ry and Ra are larger under fluctuating magnetic field than steady magnetic field. The more effective polishing can be explained with the cluster model of particles.