Design and validation of a novel master-making process chain for organic and large area electronics on flexible substrates
Design and validation of a novel master-making process chain for organic and large area electronics on flexible substrates
复制标题
柔性基板上的有机和大面积电子器件的新型母版制作工艺链的设计和验证
DOI：
10.1016/j.mee.2010.01.015
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发表时间：
2010
影响因子：
2.3
通讯作者：
S. Dimov
中科院分区：
文献类型：
--
作者：
V. Velkova;G. Lalev;H. Hirshy;S. Scholz;J. Hiitola;H. Gold;A. Haase;J. Hast;B. Stadlober;S. Dimov
