Mechanical response and microstructure of 2D carbon fiber reinforced CMCs containing Cu-Si alloy exposed to fatigue stresses
Mechanical response and microstructure of 2D carbon fiber reinforced CMCs containing Cu-Si alloy exposed to fatigue stresses
复制标题
疲劳应力下含铜硅合金的二维碳纤维增强 CMC 的机械响应和微观结构
DOI：
10.1016/j.compositesb.2018.10.016
复制
发表时间：
2019-03
期刊：
影响因子：
--
通讯作者：
Yang Li
中科院分区：
文献类型：
--
作者：
Wei Zhou;Yang Li
研究了以平纹纤维织物为增强体的反应熔渗（RMI）C/C-SiC-Cu 3Si复合材料拉伸疲劳前后的组织和力学性能。结果表明，C/C-SiC-Cu 3Si复合材料具有良好的抗疲劳性能，其疲劳极限为65 MPa，约为原始试样准静态拉伸强度的72%。此外，在准静态加载过程中，在疲劳后的试样中观察到的弹性模量略有下降的代价强度增强。经65 MPa疲劳载荷105次循环后，试样的残余抗拉强度提高到104 MPa，比原始试样提高了15.5%。有关裂纹密度和断裂表面的微观结构分析表明，裂纹的繁殖和扩展以及界面脱粘（最明显的疲劳损伤）是疲劳试验后强度较高的原因。
Microstructures, mechanical properties of reactive melt infiltration (RMI) derived C/C-SiC-Cu3Si composites with plain-weave fiber fabrics as reinforcement before and after exposure to tensile fatigue stresses have been investigated. Results show that C/C-SiC-Cu3Si composites have good resistance with fatigue limit of 65 MPa, about 72% of quasi-static tensile strength of virgin specimens. Moreover, strength enhancement at expense of slightly decreased elastic modulus is observed in post-fatigue specimens during quasi-static loading. Residual tensile strength after fatigue loadings with 65 MPa for 105cycles increases to 104 MPa, about 15.5% higher than that of virgin specimens. Microstructural analysis regarding to crack density and fractured surface indicates that crack multiplication and propagation together with interfacial debonding as the most pronounced fatigue damages are responsible for the higher strength after fatigue tests.
登录
查看更多内容
影响因子：
5.3
作者：
B. Ahn;W. Curtin
通讯作者：
B. Ahn;W. Curtin
影响因子：
5.2
作者：
Y. Tong;S. Bai;H. Zhang;Ke Chen
通讯作者：
Y. Tong;S. Bai;H. Zhang;Ke Chen
影响因子：
5.7
作者：
N. Langhof;M. Rabenstein;Jens Rosenlöcher;Reinhard Hackenschmidt;W. Krenkel;F. Rieg
通讯作者：
N. Langhof;M. Rabenstein;Jens Rosenlöcher;Reinhard Hackenschmidt;W. Krenkel;F. Rieg
DOI：
10.1111/j.1744-7402.2005.02012.x
发表时间：
2005-03
影响因子：
2.1
作者：
H. A. El-Hija;W. Krenkel;Stefan Hugel
通讯作者：
H. A. El-Hija;W. Krenkel;Stefan Hugel
影响因子：
5.2
作者：
Yiguang Wang;Xiaojuan Zhu;Litong Zhang;Lai-fei Cheng
通讯作者：
Yiguang Wang;Xiaojuan Zhu;Litong Zhang;Lai-fei Cheng