The effect of dentine surface preparation and reduced application time of adhesive on bonding strength
The effect of dentine surface preparation and reduced application time of adhesive on bonding strength
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DOI：
10.1016/j.jdent.2016.02.001
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发表时间：
2016-04-01
影响因子：
4.4
通讯作者：
Sano, Hidehiko
中科院分区：
文献类型：
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作者：
Saikaew, Pipop;Chowdhury, A. F. M. Almas;Sano, Hidehiko
目的：方法：选择60颗磨牙，随机分为12组（n = 5），每组12颗，分别采用G-PremioBond（GP，GC Corp.，东京，日本），Clearfil Universal Bond（CU，Kuraray Noritake Dental Inc.，冈山，日本）和Scotchbond通用粘合剂（SB，3 M ESPE，圣保罗，明尼苏达州，美国）;（2）涂抹层制备：SiC纸研磨牙本质或钻头切割牙本质;（3）施用时间：缩短的时间或按照制造商的说明。在蒸馏水（37 ℃）中储存24小时后，根据非修剪技术（1 mm（2））对每组15个树脂-牙本质棒进行微拉伸粘结强度测试（mu TBS）。通过三因素ANOVA和Dunnett T3检验（α = 0.05）分析数据。在扫描电子显微镜（SEM）下观察断裂表面。结果：SiC磨粒牙本质按说明书粘接时，表面粗糙度（μ TBS）较高。与钻头切割的牙本质粘结导致mu TBS显著降低（p < 0.000）。缩短应用时间导致CU对SiC和GP对钻头切割牙本质的粘结强度显著降低。断裂表面的SEM显示在粘合剂树脂界面处具有大量孔隙的区域。这是更明显的粘合剂时，减少应用时间和钻头切割牙本质。(C)2016爱思唯尔有限公司版权所有
Objective: This study evaluated the effects of surface preparation and the application time of adhesives on the resin-dentine bond strengths with universal adhesives.Methods: Sixty molars were cut to exposed mid-coronal dentine and divided into 12 groups (n = 5) based on three factors; (1) adhesive: G-Premio Bond (GP, GC Corp., Tokyo, Japan), Clearfil Universal Bond (CU, Kuraray Noritake Dental Inc., Okayama, Japan) and Scotchbond Universal Adhesive (SB, 3M ESPE, St. Paul, MN, USA); (2) smear layer preparation: SiC paper ground dentine or bur-cut dentine; (3) application time: shortened time or as manufacturer's instruction. Fifteen resin-dentine sticks per group were processed for microtensile bond strength test (mu TBS) according to non-trimming technique (1 mm(2)) after storage in distilled water (37 degrees C) for 24 h. Data were analyzed by three-way ANOVA and Dunnett T3 tests (alpha = 0.05). Fractured surfaces were observed under scanning electron microscope (SEM). Another 12 teeth were prepared and cut into slices for SEM examination of bonded interfaces.Results: mu TBS were higher when bonded to SiC-ground dentine according to manufacturer's instruction. Bonding to bur-cut dentine resulted in significantly lower mu TBS (p < 0.000). Shortening the application time resulted in significantly lower bond strength for CU on SiC and GP on bur-cut dentine. SEM of fractured surfaces revealed areas with a large amount of porosities at the adhesive resin interface. This was more pronounced when adhesives were bonded with a reduced application time and on bur cut dentine. (C) 2016 Elsevier Ltd. All rights reserved.