High strength and thermal stability of bulk Cu/Ta nanolamellar multilayers fabricated by cross accumulative roll bonding

High strength and thermal stability of bulk Cu/Ta nanolamellar multilayers fabricated by cross accumulative roll bonding
复制标题

交叉累积辊压接合制备块状铜/钽纳米层状多层膜的高强度和热稳定性

DOI:
10.1016/j.actamat.2016.03.034
复制
发表时间:
2016-05-15
期刊:
影响因子:
9.4
通讯作者:
Zhang, T.
Zhang, T.
中科院分区:
材料科学1区
文献类型:
--
作者:
Zeng, L. F.;Gao, R.;Zhang, T.

文献摘要

被引文献

相似文献

通过交叉累积轧制键合(CARB)和中间退火步骤的组合成功地制备了单个层厚度从几微米到50 nm的块体Cu/Ta纳米层多层膜。这种制造技术允许有效地抑制塑性不稳定性和边缘裂纹的形成,在重复轧制过程中。随着层厚度的减小,观察到分层形态从亚微米级的非平面界面向纳米级的近平面界面转变。高分辨透射电子显微镜、选区电子衍射和X射线衍射分析结果表明,层厚为50 nm的Cu/Ta纳米多层膜具有{100}(Ta)[110]平行于{110}(Cu)[111]的轧制织构关系。拉伸试验表明,复合材料的极限抗拉强度达到950 MPa,比原始纯Cu和Ta的极限抗拉强度提高约5倍。所制备的多层膜的硬度即使在500 ℃下退火1小时后也保持不变。这些独特的性能是由于一个原子级平坦的晶界界面和少量的同质相晶界CARB过程中产生的。(C)2016 Acta Materialia Inc.由爱思唯尔有限公司出版。保留所有权利。
Bulk Cu/Ta nanolamellar multilayers with an individual layer thickness from several micrometers down to 50 nm were successfully fabricated via a combination of cross accumulative roll bonding (CARB) and an intermediate annealing step. This fabrication technique allowed to effectively suppress the formation of plastic instabilities and edge cracks during the repeated rolling process. A transition of the layered morphology from non-planar interfaces at the submicron level to nearly planar interfaces at the nano scale was observed with decreasing layer thickness. High resolution transmission electron microscopy, selected area electron diffraction and X-ray diffraction were performed, and the results indicate that the Cu/Ta nanolamellar multilayers with a layer thickness of 50 nm show a {100}(Ta)[110]parallel to{110}(Cu)[111] rolling texture relationship. Tensile tests revealed that the ultimate tensile strength of the composite was up to 950 MPa, which is approximately 5 times higher than that of the initial pure Cu and Ta. The hardness of the prepared multilayer maintained unchanged even after an annealing at 500 degrees C for 1 h. These unique properties are attributed to an atomically flat bimetal interface and the low amount of homophase grain boundaries resulted from the CARB process. (C) 2016 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.