Quantitative mechanisms behind the synchronous increase of strength and electrical conductivity of cold-drawing oxygen-free Cu wires
Quantitative mechanisms behind the synchronous increase of strength and electrical conductivity of cold-drawing oxygen-free Cu wires
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DOI：
10.1016/j.jallcom.2021.158759
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发表时间：
2021-05
影响因子：
6.2
通讯作者：
P. Sun;Peiqiang Zhang;J. Hou;Qi Wang;Z. F. Zhang
中科院分区：
文献类型：
--
作者：
P. Sun;Peiqiang Zhang;J. Hou;Qi Wang;Z. F. Zhang
High strength and high electrical conductivity (EC) are the key performance for Cu wire. However, the trade-off relation between the strength and the electrical conductivity limits the application of high-performance Cu wires. In the study, the simultaneous increase of strength and electrical conductivity was found in the oxygen-free Cu wire (OFCW) manufactured by cold-drawing process. The results show that the dislocation, texture and grain are three main factors influencing the strength and electrical conductivity of the cold-drawing OFCWs. Moreover, the contribution of microstructures to strength and electrical conductivity was calculated quantitatively. Three strengthening mechanisms including dislocation, grain boundary and<111>texture strengthening are considered to be the main factors that strengthen the cold-drawing OFCWs. Besides, the elongated grains and the dislocation recovery are responsible for the increase of electrical conductivity. Finally, the thin-long grains are revealed to be the key factor leading to the synchronous increase of strength and electrical conductivity.
