Three-dimensional micro-channel fabrication in polydimethylsiloxane (PDMS) elastomer

Three-dimensional micro-channel fabrication in polydimethylsiloxane (PDMS) elastomer
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DOI:
10.1109/84.825780
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发表时间:
2000-03-01
影响因子:
2.7
通讯作者:
Beebe, DJ
Beebe, DJ
中科院分区:
工程技术3区
文献类型:
--
作者:
Jo, BH;Van Lerberghe, LM;Beebe, DJ

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本文描述了一种在聚二甲基硅氧烷(PDMS)弹性体中构建三维(3-D)微通道的制造技术,该工艺允许堆叠许多薄的(小于100 μ m厚)图案化PDMS层以实现复杂的3-D通道路径。每层的母版使用环氧基光致抗蚀剂(SU 8)形成在硅晶片上,PDMS被浇铸在母版上,产生包含通道和开口的模制层。为了实现具有开口的薄层,开发了允许精确控制PDMS厚度的夹层成型配置。主晶片被夹在一个夹层中,该夹层包括平铝板、柔性聚酯膜层、刚性派热克斯晶片和橡胶片。一个参数的研究进行PDMS表面活化的反应性离子蚀刻系统和随后的甲醇处理的粘合和对齐非常薄的个别组件的基板。对于即时键合,低RF功率和短处理时间分别优于高RF功率和长处理时间。小于15 μ m的层与层的对准是通过利用表面张力驱动的自对准方法的手动对准技术来实现的。核心程序用于通过底部PDMS层实现芯片外流体连接,允许顶层保持光滑和平坦,以实现完整的光学访问。[444] I'm sorry.
This paper describes a fabrication technique for building three-dimensional (3-D) micro-channels in polydimethyl-siloxane (PDMS) elastomer, The process allows for the stacking of many thin (less than 100-mu m thick) patterned PDMS layers to realize complex 3-D channel paths. The master for each layer is formed on a silicon wafer using an epoxy-based photoresist (SU 8), PDMS is cast against the master producing molded layers containing channels and openings. To realize thin layers with openings, a sandwich molding configuration was developed that allows precise control of the PDMS thickness. The master wafer is clamped within a sandwich that includes flat aluminum plates, a flexible polyester film layer, a rigid Pyrex wafer, and a rubber sheet. A parametric study is performed on PDMS surface activation in a reactive-ion-etching system and the subsequent methanol treatment for bonding and aligning very thin individual components to a substrate. Low RF power and short treatment times are better than high RF power and long treatment times, respectively, for instant bonding. Layer-to-layer alignment of less then 15 mu m is achieved with manual alignment techniques that utilize surface tension driven self-alignment methods. A coring procedure is used to realize off-chip fluidic connections via the bottom PDMS layer, allowing the top layer to remain smooth and flat for complete optical access. [444].