Electrically conductive filament for 3D-printed circuits and sensors

Electrically conductive filament for 3D-printed circuits and sensors
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DOI:
10.1016/j.apmt.2017.07.001
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发表时间:
2017-12-01
影响因子:
8.3
通讯作者:
Goh, Kuan Eng Johnson
Goh, Kuan Eng Johnson
中科院分区:
材料科学2区
文献类型:
--
作者:
Kwok, Sen Wai;Goh, Kok Hin Henry;Goh, Kuan Eng Johnson

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3D打印是一项独特的技术,它可能为包含电子元件的实用产品的定制提供高度的自由度,例如可穿戴应用中的传感器。在集成电子元件的定制产品3D打印的全部潜力得以实现之前,在制造此类电路和传感器时,廉价、可靠、导电材料的可用性将是不可或缺的。迄今为止,具有足够高的电导率来制造实际电路的3D打印导电丝仍然缺乏熔融沉积建模。本文描述了一种低成本热塑性导电复合材料的制造、表征、应力测试和应用,该复合材料已加工成用于3D打印的长丝形式。应力测试结果表明,我们的复合材料在阳光下暴露1个月以上,电性能稳定,在12 V (AC)下使用7天,电阻没有明显下降。实际电路使用电阻率为5 x 10(-3) ω m的细丝3D打印,并使用9v电池供电。一个塑料温度计和一个弯曲传感器的原型,以说明这种材料在传感应用中的潜力,例如,在定制的可穿戴设备中。(C) 2017年作者。Elsevier Ltd.出版。这是一篇基于CC BY许可的开放获取文章
3D printing is a unique technology that potentially offers a high degree of freedom for the customization of practical products that incorporate electrical components, such as sensors in wearable applications. The availability of inexpensive, reliable, electrically conductive material will be indispensable in the fabrication of such circuits and sensors before the full potential of 3D printing for customized products incorporating electrical elements can be realized. To date, 3D printable conductive filaments with sufficiently high conductivities to fabricate practical circuits remain lacking for fused deposition modeling. Herein, we describe the fabrication, characterization, stress testing, and application of a low-cost thermoplastic conductive composite that has been processed into filament form for 3D printing. Results from stress tests show that the electrical properties of our composites are stable under exposure to sunlight over 1 month and there was no observable degradation in electrical resistance when used at 12 V (AC) for 7 days. Practical circuits were 3D printed using filaments with resistivity of 5 x 10(-3) Omega m, and powered up with a 9 V battery. A plastic thermometer and a flex sensor were prototyped to illustrate the potential of this material for sensing applications, for example, in customized wearables. (C) 2017 The Authors. Published by Elsevier Ltd. This is an open access article under the CC BY license