Superconducting Cu/Nb nanolaminate by coded accumulative roll bonding and its helium damage characteristics
Superconducting Cu/Nb nanolaminate by coded accumulative roll bonding and its helium damage characteristics
复制标题
编码累积辊压超导铜/铌纳米叠层及其氦损伤特性
DOI：
10.1016/j.actamat.2020.07.031
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发表时间：
2020-09-15
期刊：
影响因子：
9.4
通讯作者：
Li, Ju
中科院分区：
文献类型：
--
作者：
Gao, Rui;Jin, Miaomiao;Li, Ju
一个非常广泛的分布的微观结构的长度尺度跨越几纳米到微米级已被证明有效地实现特殊的材料性能。在这里，我们制造的Cu/Nb两相复合材料的分层结构，通过修改传统的累积轧制结合（ARB）技术，其中新鲜的Nb片插入并结合在一个重复的堆叠和轧制过程。这种具有设计的分级长度尺度分布的条形码状多层膜具有密集分布的相界和丰富的界面结构。该复合材料表现出与纯Nb类似的超导特性，但强度是纯Nb的3倍，理论上具有更好的抗氧化性，并保持相当大的延展性。在氦辐照环境下，具有化学混合区（3维）的独特界面结构比原子级尖锐界面（2维）更能抵抗大氦团簇的形成，使其免受辐射损伤并提高其长期机械完整性。这项工作标志着一个有效的策略，构建分层层压板，以实现高性能材料，这在聚变和裂变能源的应用前景。(C)2020由Elsevier Ltd代表Acta Materialia Inc.发布。
A very broad distribution of microstructural length scales spanning few nm- to the mu m-scale has proven effective to achieve exceptional materials properties. Here, we fabricate a Cu/Nb two-phase composite made of a hierarchically layered structure by modifying the conventional accumulative roll bonding (ARB) technique, where fresh Nb sheets are inserted and bonded during a repeated stacking and rolling process. This barcode-like multilayer with a designed hierarchical length scale distribution possesses densely distributed phase boundaries and rich interfacial structures. The composite demonstrates similar superconductivity characteristics as pure Nb, but is 3 x stronger, has theoretically better oxidation resistance, and retains considerable ductility. Under the helium irradiation environment, the unique interfacial structures featuring chemical intermixing zones (3-dimensional) are more immune to the formation of large helium clusters than atomically sharp interfaces (2-dimensional), screening them from radiation damage and improving their long-term mechanical integrity. This work signifies an effective strategy of constructing hierarchical laminates to achieve high-performance materials, which holds promise in fusion and fission energy applications. (C) 2020 Published by Elsevier Ltd on behalf of Acta Materialia Inc.