A Highly Reliable Structure for Power-Semiconductor Devices That a Nano-spring Layer Absorbs Thermal Deformation
A Highly Reliable Structure for Power-Semiconductor Devices That a Nano-spring Layer Absorbs Thermal Deformation
复制标题
功率半导体器件的高度可靠结构，纳米弹簧层吸收热变形
DOI：
10.7791/jspmee.5.251
复制
发表时间：
2016
期刊：
影响因子：
--
通讯作者：
T. Kitamura
中科院分区：
文献类型：
--
作者：
H. Tanie;T. Sumigawa;T. Kitamura
开发了一种用于功率半导体器件的高可靠性接合结构。在这种结构中，管芯在其表面上具有纳米弹簧层，并且该层通过焊接结合到金属电路。纳米弹簧层是由掠射角沉积方法制成的多个纳米弹簧组成的结构。由于纳米弹簧层吸收了芯片和金属电路之间的热变形差，因此减小了结构中的热应力。在这项研究中，纳米弹簧层的铜和铝的制造方法的发展和纳米弹簧的机械特性和热特性的测量。此外，通过使用具有纳米弹簧层的管芯，演示了功率半导体器件的制造工艺。该证明证实了可以以与使用常规模具相同的方式执行制造过程，并且成功地制造了由纳米弹簧层构成的接合结构。
A highly reliable joint structure for a power-semiconductor device was developed. In this structure, a die has a nano-spring layer on its surface and this layer is bonded to a metallic circuit by soldering. The nano-spring layer is a structure composed of multiple nanoscale springs made by the glancing angle deposition method. Thermal stress in the structure is reduced because the nano-spring layer absorbs the difference of the thermal deformations between the die and the metallic circuit. In this study, a manufacturing method for a nano-spring layer made of copper and aluminum was developed and the mechanical characteristics and thermal characteristics of the nano-spring were measured. In addition, a manufacturing process for a power semiconductor device by using a die with the nano-spring layer was demonstrated. This demonstration confirmed that the manufacturing process can be carried out in the same manner as that using a conventional die and successfully manufactures a joint structure composed of a nano-spring layer.