Effect of Micropillar Spacing and Temperature of Substrate on Contact Angle Dynamics
Effect of Micropillar Spacing and Temperature of Substrate on Contact Angle Dynamics
复制标题
微柱间距和基底温度对接触角动力学的影响
DOI:
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发表时间:
2019
期刊:
影响因子:
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通讯作者:
K. Sefiane
中科院分区:
文献类型:
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作者:
Coinneach Mackenzie;G. Duursma;J. Christy;J. Terry;K. Sefiane
ABSTRACT Contact angle dynamics of droplets deposited on a structured surface were studied in this work and the effects of substrate microstructure and temperature were investigated. Microstructures consisting of uniformly-sized, cubic micropillars with varying pillar spacings were constructed by microfabrication. Droplets (of the order of tens of microlitres in volume) were deposited on these surfaces and dynamic contact angles were observed using various techniques. Advancing and receding contact angles were measured using tilting of the surfaces or by injection and aspiration of fluid from a horizontal droplet by syringe. Droplets on these surfaces appeared to be mainly in the Wenzel state. Contact angle hysteresis was obtained as a function of pillar spacing or, equivalently, surface roughness. Depinning force was deduced and a linear dependence on maximal three phase contact line was found. The techniques of tilting the surface on which the droplet was deposited and uniformly increasing and reducing the volume of the droplet via the syringe both gave the same contact angle hysteresis for a given micropillar spacing. The effect of temperature was then assessed using a heated tilting plate. Contact angle hysteresis was found to increase with temperature. Further work to elucidate mechanisms governing this dependence will be undertaken.